双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

化学成分 GAN7R0-150LBE

作为一家积极进取的可持续发展公司,安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息,恩智浦可以向我们的客户提供相关资料,以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据,这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
934665900328GAN7R0-150LBEZGAN7R0-150LBESOT8073 (FCLGA)RFS3
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASContains intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 5694 ppm; substance 65997-17-3: 16360 ppm; substance 1333-86-4: 1248 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 5694 ppm; substance 1333-86-4: 1248 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-05-3: 387 ppm; substance 7440-57-5: 185 ppm; substance 7440-22-4: 25 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
PassivationPolymerPolyimide resin0.13102094.0001500.467252
PassivationAdditiveNon hazardous0.0083605.9998500.029823
Passivation Total0.139380100.0000000.497075
Substrate/LaminateCopper alloyCopper (Cu)7440-50-85.49671073.39368819.603102
Substrate/LaminateCopper alloyPhosphorus (P)7723-14-00.0013900.0185580.004951
Plating 2 Total5.49810073.41224619.608053
Substrate/LaminatePure metal layerNickel (Ni)7440-02-00.1496401.9980370.533666
Plating 3 Total0.1496401.9980370.533666
Substrate/LaminatePure metal layerPalladium (Pd)7440-05-30.0108500.1448720.038695
Plating 4 Total0.0108500.1448720.038695
Substrate/LaminatePure metal layerGold (Au)7440-57-50.0052000.0694320.018545
Plating 5 Total0.0052000.0694320.018545
Substrate/LaminateFillerSilica -amorphous-7631-86-90.6885109.1931902.455463
Substrate/LaminateFillerGlass Fibrous65997-17-30.4587406.1252311.636022
Substrate/LaminatePolymerEpoxy resin system0.2289703.0572700.816572
Substrate/LaminatePolymerCyanate ester resin0.1523802.0346200.543422
Substrate/LaminateImpurityMisc. Chlorine compounds (generic)0.0004800.0064100.001711
Substrate/LaminateImpurityMisc. fluorine compounds (generic)0.0001300.0017400.000481
Pre-preg Total1.52921020.4184615.453671
Substrate/LaminatePolymerAcrylate Polymer0.1306901.7450110.466075
Substrate/LaminateFillerBarium sulphate7727-43-70.0862401.1515010.307545
Substrate/LaminatePolymerEpoxy resin system0.0580800.7755000.207144
Substrate/LaminateFillerTalc14807-96-60.0088900.1187000.031715
Substrate/LaminateAdditiveNon hazardous0.0088900.1187000.031715
Substrate/LaminateAdditiveSilicon dioxide7631-86-90.0017800.0237700.006345
Substrate/LaminatePigmentC.I. Pigment Blue 15147-14-80.0017800.0237700.006344
Solder Mask Total0.2963503.9569521.056883
Substrate/Laminate Total7.489350100.00000026.709513
Redistribution LayerPure metal layerCopper (Cu)7440-50-80.346900100.0000001.237161
Redistribution Layer Total0.346900100.0000001.237161
Solder Bump 1Pure metal layerCopper (Cu)7440-50-80.452700100.0000001.614479
Solder Bump 1 Total0.452700100.0000001.614479
Solder Bump 2Pure metal layerNickel (Ni)7440-02-00.010030100.0000000.035770
Solder Bump 2 Total0.010030100.0000000.035770
Solder Bump 3Tin alloyTin (Sn)7440-31-50.03828098.2042100.136513
Solder Bump 3Tin alloySilver (Ag)7440-22-40.0007001.7957900.002503
Solder Bump 3 Total0.038980100.0000000.139016
Under Bump Metallization 1Pure metal layerTitanium (Ti)7440-32-60.000030100.0000000.000107
Under Bump Metallization 1 Total0.000030100.0000000.000107
Under Bump Metallization 2Pure metal layerCopper (Cu)7440-50-80.000310100.0000000.001106
Under Bump Metallization 2 Total0.000310100.0000000.001106
UnderfillFillerSilica fused60676-86-00.43938064.5978201.566967
UnderfillPolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.21342031.3778200.761137
UnderfillAdditiveNon hazardous0.0217603.1994100.077607
UnderfillPigmentCarbon black1333-86-40.0054400.7998400.019397
UnderfillImpurityMisc. Chlorine compounds (generic)0.0001300.0190900.000457
UnderfillAdditivePolysiloxanes, Me 3,3,3-trifluoropropyl63148-56-10.0000400.0060200.000147
Underfill Total0.680170100.0000002.425712
DieDoped siliconSilicon (Si)7440-21-312.77895098.54528045.573992
DieMetallisationGallium Nitride (GaN)25617-97-40.1037400.8000000.369963
DieMetallisationAluminium (Al)7429-90-50.0849000.6547200.302783
Die Total12.967590100.00000046.246738
Mould CompoundFillerSilica fused60676-86-02.95728050.00000010.546658
Mould CompoundFillerSilica -amorphous-7631-86-91.77437030.0000006.327999
Mould CompoundPolymerEpoxy resin system0.97591016.5000003.480399
Mould CompoundPolymerPhenolic resin0.1774403.0000000.632799
Mould CompoundPigmentCarbon black1333-86-40.0295700.5000000.105468
Mould Compound Total5.914570100.00000021.093323
GAN7R0-150LBE Total28.040010100.000000100.000000
Notes
Report created on 2024-11-03 12:08:10 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-11-03 12:08:10 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
钝化层 (Passivation)
基板/层压板 (Substrate/Laminate)
重布层 (Redistribution Layer)
焊锡凸块1 (Solder Bump 1)
焊锡凸块2 (Solder Bump 2)
焊锡凸块3 (Solder Bump 3)
底部金属层1 (Under Bump Metallization 1)
底部金属层2 (Under Bump Metallization 2)
底部填充料 (Underfill)
半导体芯片 (Die)
模封料 (Mould Compound)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-11-03 12:08:10 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.