双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

化学成分 PDTC124EMB

作为一家积极进取的可持续发展公司,安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息,恩智浦可以向我们的客户提供相关资料,以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据,这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
934065923315PDTC124EMB,315PDTC124EMBSOT883B (XQFN3)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 33881 ppm; substance 1333-86-4: 2359 ppm; substance 7439-92-1: 2 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 33880 ppm; substance 1333-86-4: 2358 ppm; substance 7439-92-1: 1 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 4813 ppm; substance 7440-57-5: 12416 ppm; substance 7440-05-3: 1259 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.00304076.0000000.481298
AdhesivePolymerPhenolic resin0.00054113.5300000.085684
AdhesivePolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00041910.4700000.066305
Adhesive Total0.004000100.0000000.633287
DieDoped siliconSilicon (Si)7440-21-30.026000100.0000004.116367
Die Total0.026000100.0000004.116367
Lead FrameCopper alloyCopper (Cu)7440-50-80.24942291.03000039.488969
Lead FrameCopper alloyNickel (Ni)7440-02-00.0077822.8400001.231997
Lead FrameCopper alloySilicon (Si)7440-21-30.0016990.6200000.268957
Lead FrameCopper alloyMagnesium (Mg)7439-95-40.0004660.1700000.073746
Base Alloy Total0.25936994.66000041.063669
Lead FramePure metal layerGold (Au)7440-57-50.0002180.0800000.034705
Pre-Plating 1 Total0.0002180.0800000.034705
Lead FramePure metal layerPalladium (Pd)7440-05-30.0007950.2900000.125802
Pre-Plating 2 Total0.0007950.2900000.125802
Lead FramePure metal layerNickel (Ni)7440-02-00.0136184.9700002.155994
Pre-Plating 3 Total0.0136184.9700002.155994
Lead Frame Total0.274000100.00000043.380170
Mould CompoundFillerSilica fused60676-86-00.17880060.00000028.307936
Mould CompoundFillerSilica7631-86-90.06854023.00000010.851375
Mould CompoundPolymerEpoxy resin system0.0208607.0000003.302593
Mould CompoundPolymerPhenolic resin0.0178806.0000002.830794
Mould CompoundFlame retardantAluminium hydroxide (Al(OH)3)21645-51-20.0089403.0000001.415397
Mould CompoundPigmentCarbon black1333-86-40.0014900.5000000.235899
Mould CompoundIon trapping agentBismuth (Bi)7440-69-90.0014900.5000000.235899
Mould Compound Total0.298000100.00000047.179893
Post-PlatingTin solderTin (Sn)7440-31-50.02198799.9400003.480989
Post-PlatingImpurityNon-declarable0.0000120.0555000.001933
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000157
Post-Plating Total0.022000100.0000003.483079
WirePure metalGold (Au)7440-57-50.00762499.9900001.207083
WireImpurityNon-declarable0.0000010.0100000.000121
Wire Total0.007625100.0000001.207204
PDTC124EMB Total0.631625100.000000100.000000
Notes
Report created on 2024-11-24 18:17:59 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-11-24 18:17:59 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)
半导体芯片 (Die)
基底合金 (Base Alloy)
预镀层1 (Pre-Plating 1)
预镀层2 (Pre-Plating 2)
预镀层3 (Pre-Plating 3)
模封料 (Mould Compound)
后镀层 (Post-Plating)
导线 (Wire)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-11-24 18:17:59 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.