化学成分 PESD5V0H1BLG-Q

作为一家积极进取的可持续发展公司，安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息，恩智浦可以向我们的客户提供相关资料，以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据，这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934665103303	PESD5V0H1BLG-QZ	PESD5V0H1BLG-Q	SOD882LD-1 (DFN1006LD-2)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 116 ppm; substance 65997-17-3: 37077 ppm; substance 1333-86-4: 2014 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 116 ppm; substance 75980-60-8: 3 ppm; substance 1333-86-4: 2014 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-05-3: 2827 ppm; substance 7440-57-5: 760 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Substrate/Laminate	Pure metal layer	Copper (Cu)	7440-50-8	0.082283	72.177950	29.075265
Substrate/Laminate	Impurity	Non-declarable		0.000072	0.062850	0.025442
Substrate/Laminate	Impurity	Phosphorus (P)	7723-14-0	0.000011	0.009790	0.003887
		Plating 1 Total		0.082366	72.250590	29.104594
Substrate/Laminate	Pure metal layer	Nickel (Ni)	7440-02-0	0.000033	0.028890	0.011661
		Plating 2 Total		0.000033	0.028890	0.011661
Substrate/Laminate	Pure metal layer	Palladium (Pd)	7440-05-3	0.000800	0.701890	0.282685
		Plating 3 Total		0.000800	0.701890	0.282685
Substrate/Laminate	Pure metal layer	Gold (Au)	7440-57-5	0.000215	0.188450	0.075972
		Plating 4 Total		0.000215	0.188450	0.075972
Substrate/Laminate	Pure metal layer	Copper (Cu)	7440-50-8	0.000001	0.001120	0.000353
		Plating 5 Total		0.000001	0.001120	0.000353
Substrate/Laminate	Pure metal layer	Titanium (Ti)	7440-32-6	0.000011	0.009260	0.003887
		Plating 6 Total		0.000011	0.009260	0.003887
Substrate/Laminate	Filler	Glass, oxide, chemicals (fibrous)	65997-17-3	0.010493	9.204680	3.707774
Substrate/Laminate	Pure metal layer	Silica fused	60676-86-0	0.010493	9.204680	3.707774
Substrate/Laminate	Polymer	Resin system		0.005113	4.484670	1.806714
Substrate/Laminate	Impurity	Calcium fluoride	7789-75-5	0.000018	0.015770	0.006360
		Pre-preg Total		0.026117	22.909800	9.228622
Substrate/Laminate	Polymer	Acrylic resin		0.002344	2.055930	0.828268
Substrate/Laminate	Flame retardant	Barium sulfate (BaSO4)	7727-43-7	0.001627	1.427040	0.574912
Substrate/Laminate	Additive	Non-declarable		0.000258	0.226650	0.091166
Substrate/Laminate	Additive	Talc	14807-96-6	0.000191	0.167890	0.067491
Substrate/Laminate	Pigment	C.I. Pigment Blue 15	147-14-8	0.000033	0.029380	0.011661
Substrate/Laminate	Impurity	2-Benzyl-2-(dimethylamino)-1-(4-morpholinophenyl)-1-butanone	119313-12-1	0.000002	0.001970	0.000707
Substrate/Laminate	Impurity	Misc. chlorine compounds (generic)		0.000001	0.000680	0.000353
Substrate/Laminate	Impurity	(2,4,6-Trimethylbenzoyl)diphenylphosphine oxide	75980-60-8	0.000001	0.000460	0.000353
		Solder Mask Total		0.004457	3.910000	1.574911
		Substrate/Laminate Total		0.114000	100.000000	40.282685

Die	Doped silicon	Silicon (Si)	7440-21-3	0.055000	100.000000	19.434629
		Die Total		0.055000	100.000000	19.434629

Mould Compound	Filler	Silica fused	60676-86-0	0.062700	55.000000	22.155477
Mould Compound	Filler	Silica	7631-86-9	0.034200	30.000000	12.084806
Mould Compound	Polymer	Phenolic resin		0.006840	6.000000	2.416961
Mould Compound	Polymer	Epoxy resin system		0.006270	5.500000	2.215548
Mould Compound	Flame retardant	Aluminium hydroxide (Al(OH)3)	21645-51-2	0.003420	3.000000	1.208481
Mould Compound	Pigment	Carbon black	1333-86-4	0.000570	0.500000	0.201413
		Mould Compound Total		0.114000	100.000000	40.282686

		PESD5V0H1BLG-Q Total		0.283000		100.000000

Notes
Report created on 2025-02-16 19:28:54 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-02-16 19:28:54 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名称 Material	有毒或有害物质和元素 (Toxic or hazardous substances and elements)
部件名称 Material	铅 (Pb)	镉 (Cd)	汞 (Hg)	六价铬 (Cr⁶⁺)	多溴联苯 (PBB)	多溴二苯醚 (PBDE)
镀层1 (Plating 1)	◯	◯	◯	◯	◯	◯
镀层2 (Plating 2)	◯	◯	◯	◯	◯	◯
镀层3 (Plating 3)	◯	◯	◯	◯	◯	◯
镀层4 (Plating 4)	◯	◯	◯	◯	◯	◯
镀层5 (Plating 5)	◯	◯	◯	◯	◯	◯
镀层6 (Plating 6)	◯	◯	◯	◯	◯	◯
黏合胶片 (Pre-preg)	◯	◯	◯	◯	◯	◯
防焊绿漆 (Solder Mask)	◯	◯	◯	◯	◯	◯
半导体芯片 (Die)	◯	◯	◯	◯	◯	◯
模封料 (Mould Compound)	◯	◯	◯	◯	◯	◯

◯	表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
✕	表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	该半导体产品具有无限期的环保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-02-16 19:28:54 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

所有产品

双极性晶体管

二极管

ESD保护、TVS、信号调节

MOSFET

SiC MOSFETs

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车

所有应用

汽车

工业和电力

移动和可穿戴应用

计算和消费电子

Sub-systems: Power conversion topologies

子系统

参考设计

评估板

Interactive application notes

Advanced Support Tools

化学成分 PESD5V0H1BLG-Q

双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

化学成分 PESD5V0H1BLG-Q