外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| OL-PMCM6501FNE | WLCSP6 | WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) | 2015-07-20 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| OL-PMCM6501VPE | 3D model for products with OL-PMCM6501VPE package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| OL-PMCM6501FNE | wafer level chip-scale package; 6 bumps; 1.48 x 0.98 x 0.35 mm | Package information | 2020-12-14 |
| OL-PMCM6501VPE | WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) | Package information | 2020-04-21 |
采用此封装的产品
MOSFETs
| 型号 | 描述 | 快速访问 |
|---|---|---|
| PMCM6501VPE | 12 V, P-channel Trench MOSFET |