外形图
封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
---|---|---|---|---|
SOT371-1 | SSOP56 | plastic, shrink small outline package; 56 leads; 0.635 mm pitch; 18.45 mm x 7.5 mm x 2.8 mm body | MO-118 (JEDEC) | 2003-02-18 |
相关文档
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SOT371-1 | plastic, shrink small outline package; 56 leads; 0.635 mm pitch; 18.45 mm x 7.5 mm x 2.8 mm body | Package information | 2020-04-21 |
SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
采用此封装的产品
Analog & Logic ICs
型号 | 描述 | 快速访问 |
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