外形图
封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
---|---|---|---|---|
SOT519-1 | SSOP16 | plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body | 2003-02-18 |
相关文档
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT519-1 | 3D model for products with SOT519-1 package | Design support | 2023-02-07 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SOT519-1 | plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body | Package information | 2022-06-20 |
SOT519-1_118 | SSOP16; Reel pack for SMD, 13''; Q1/T1 product orientation | Packing information | 2020-04-21 |
SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
采用此封装的产品
Analog & Logic ICs
型号 | 描述 | 快速访问 |
---|---|---|
74CBTLV3253DS | Dual 1-of-4 multiplexer/demultiplexer | |
74CBTLV3257DS | Quad 1-of-2 multiplexer/demultiplexer | |
74CBTLV3125DS | 4-bit bus switch | |
74CBTLV3126DS | 4-bit bus switch | |
CBT3257ADS | Quad 1-of-2 multiplexer/demultiplexer | |
CBT3253ADS | Dual 1-of-4 FET multiplexer/demultiplexer |
Automotive qualified products (AEC-Q100/Q101)
型号 | 描述 | 快速访问 |
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