外形图
封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
---|---|---|---|---|
SOT764-1 | DHVQFN20 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | MO-241 (JEDEC) | 2014-12-12 |
相关文档
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
SOT764-1_115 | DHVQFN20; Reel pack for SMD, 7''; Q1/T1 product orientation | Packing information | 2020-04-21 |
采用此封装的产品
Analog & Logic ICs
型号 | 描述 | 快速访问 |
---|---|---|
74HC574BQ | Octal D-type flip-flop; positive edge-trigger; 3-state |
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