外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT8047-1 | HWSON | plastic thermal enhanced very very thin small outline package; no leads; 8 terminals; 0.8 mm pitch; 4 x 4 x 0.75 mm body | MO-229 compatible (JEDEC) | 2022-03-16 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT8047-1 | plastic thermal enhanced very very thin small outline package; no leads;8 terminals; 0.8 mm pitch; 4 x 4 x 0.75 mm body | Package information | 2024-08-21 |
| SOT8047-1_118 | HWSON8; Reel pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2024-09-19 |