外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT8063-1 | HSO8 | plastic thermal enhanced small outline package; 8 leads; 1.27 mm pitch; 4.9 mm × 3.9 mm ×1.7 mm body; exposed die pad | MS-012 (JEDEC) | 2024-08-01 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT8063-1 | plastic thermal enhanced small outline package; 8 leads; 1.27 mm pitch;4.9 mm × 3.9 mm ×1.7 mm body; exposed die pad | Package information | 2024-09-24 |
| SOT8063-1_118 | HSO8; Reel pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2024-09-19 |
采用此封装的产品
Analog & Logic ICs
| 型号 | 描述 | 快速访问 |
|---|---|---|
| NGD4300DD-Q100 | 4 A peak high-performance dual MOSFET gate driver | |
| NGD4300DD | 4 A peak high-performance dual MOSFET gate driver |