外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT8109-1 | HWQFN16 | HWQFN16: plastic thermal enhanced very very thin Quad Flat package; 16 terminals; no leads; 0.65 mm pitch; 4 x 4 x 0.75 mm body | MO-220 (JEDEC) | 2024-12-18 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT8109-1 | HWQFN16: plastic thermal enhanced very very thin Quad Flat package; 16 terminals; no leads; 0.65 mm pitch; 4 x 4 x 0.75 mm body | Package information | 2025-02-04 |
| SOT8109-1_518 | HWQFN16; Reel dry pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2025-01-27 |
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| 型号 | 描述 | 快速访问 |
|---|---|---|
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