双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

WLCSP5_2-1-2

WLCSP5_2-1-2

wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body

外形图

封装版本 封装名称 封装说明 参考 发行日期
WLCSP5_2-1-2 WLCSP5 wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body 2010-02-11

相关文档

文件名称 标题 类型 日期
WLCSP5_2-1-2 3D model for products with WLCSP5_2-1-2 package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
WLCSP5_2-1-2_mk wafer level chip-size package; 5 bumps (2-1-2) Marcom graphics 2017-01-28
WLCSP5_2-1-2 wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body Package information 2020-04-21

采用此封装的产品

ESD protection, TVS, filtering and signal conditioning

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PCMF1USB3S Common-mode EMI filter for differential channels with integrated ESD protection
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PCMF1USB30 Common-mode EMI filter for differential channels with integrated ESD protection
PESD1USB3B ESD protection for differential data lines
PESD1USB30 ESD protection for differential data lines
PCMF1USB3BA Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
PCMF1USB3B Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
PESD1USB3S ESD protection for differential data lines
PCMF1HDMI14S Common-mode EMI filter for differential channels with integrated ESD protection