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Click here for more informationBUK7Y2R0-40H
N-channel 40 V, 2.0 mΩ standard level MOSFET in LFPAK56
Automotive qualified N-channel MOSFET using the latest Trench 9 low ohmic superjunction technology, housed in a robust LFPAK56 package. This product has been fully designed and qualified to meet AEC-Q101 requirements delivering high performance and endurance.
Features and benefits
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Fully automotive qualified to AEC-Q101:
175 °C rating suitable for thermally demanding environments
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Trench 9 Superjunction technology:
Reduced cell pitch enables enhanced power density and efficiency with lower RDSon in same footprint
Improved SOA and avalanche capability compared to standard TrenchMOS
Tight VGS(th) limits enable easy paralleling of MOSFETs
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LFPAK Gull Wing leads:
High Board Level Reliability absorbing mechanical stress during thermal cycling, unlike traditional QFN packages
Visual (AOI) soldering inspection, no need for expensive x-ray equipment
Easy solder wetting for good mechanical solder joint
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LFPAK copper clip technology:
Improved reliability, with reduced Rth and RDSon
Increases maximum current capability and improved current spreading
Applications
12 V automotive systems
Motors, lamps and solenoid control
Start-Stop micro-hybrid applications
Transmission control
Ultra high performance power switching
参数类型
型号 | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Release date |
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BUK7Y2R0-40H | SOT669 | LFPAK56; Power-SO8 | Production | N | 1 | 40 | 2 | 175 | 120 | 10.8 | 52.6 | 217 | 21 | 3 | Y | 3633 | 984 | 2015-05-11 |
Series
文档 (21)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
BUK7Y2R0-40H | N-channel 40 V, 2.0 mΩ standard level MOSFET in LFPAK56 | Data sheet | 2018-05-11 |
AN10273 | Power MOSFET single-shot and repetitive avalanche ruggedness rating | Application note | 2022-06-20 |
AN10874_ZH | LFPAK MOSFET thermal design guide, Chinese version | Application note | 2020-04-30 |
AN11113_ZH | LFPAK MOSFET thermal design guide - Part 2 | Application note | 2020-04-30 |
AN11158 | Understanding power MOSFET data sheet parameters | Application note | 2020-07-06 |
AN11160 | Designing RC Snubbers | Application note | 2023-02-03 |
AN11243 | Failure signature of Electrical Overstress on Power MOSFETs | Application note | 2017-12-21 |
AN11261 | RC Thermal Models | Application note | 2021-03-18 |
AN11599 | Using power MOSFETs in parallel | Application note | 2016-07-13 |
AN50006 | Power MOSFETs in linear mode | Application note | 2022-04-12 |
AN90001 | Designing in MOSFETs for safe and reliable gate-drive operation | Application note | 2017-05-05 |
SOT669 | 3D model for products with SOT669 package | Design support | 2017-06-30 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
LFPAK56_POWER-SO8_SOT669_mk | plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm body | Marcom graphics | 2017-01-28 |
BUK7xxxx-40H_LTspice_V3 | BUK7xxxx-40H Precision ElectroThermal (PET) LTspice model | PET SPICE model | 2022-09-26 |
SOT669 | plastic, single-ended surface-mounted package; 4 terminals | Package information | 2022-05-30 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
BUK7Y2R0-40H | BUK7Y2R0-40H | SPICE model | 2017-08-11 |
TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2024-08-09 |
BUK7Y2R0-40H_RCthermal | BUK7Y2R0-40H_RCthermal | Thermal design | 2017-08-11 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
BUK7xxxx-40H_LTspice_V3 | BUK7xxxx-40H Precision ElectroThermal (PET) LTspice model | PET SPICE model | 2022-09-26 |
BUK7Y2R0-40H | BUK7Y2R0-40H | SPICE model | 2017-08-11 |
BUK7Y2R0-40H_RCthermal | BUK7Y2R0-40H_RCthermal | Thermal design | 2017-08-11 |
SOT669 | 3D model for products with SOT669 package | Design support | 2017-06-30 |
订购、定价与供货
样品
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如果您没有 Nexperia 的直接账户,我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.