双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

BSP230

P-channel vertical D-MOS intermediate level FET

P-channel enhancement mode vertical Double-Diffused Field-Effect Transistor (D-MOSFET) in a SOT89 (SC-62) medium power and flat lead Surface Mounted Device (SMD) plastic package.

此产品已停产

Features and benefits

  • Direct interface to Complementary (C-MOS) transitor and Transistor-Transistor Logic (TTL) devices

  • Very fast switching

  • No secondary breakdown

Applications

  • High-speed line drivers

  • Line current interruptors in telephone sets

  • Line transformer drivers

  • Relay drivers

参数类型

型号 Package version Package name Product status Channel type VDS [max] (V) Ptot [max] (W) Release date
BSP230 SOT223 SC-73 End of life P -300 1.5 2011-01-24

封装

下表中的所有产品型号均已停产 。

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
BSP230 BSP230,135
(934024380135)		 Discontinued / End-of-life BSP230 SOT223
SC-73
(SOT223) 		SOT223 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_135

环境信息

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
BSP230 BSP230,135 BSP230 rohs rhf rhf
品质及可靠性免责声明

文档 (18)

文件名称 标题 类型 日期
BSP230 P-channel enhancement mode vertical D-MOS transistor Data sheet 2010-02-16
AN10273 Power MOSFET single-shot and repetitive avalanche ruggedness rating Application note 2022-06-20
AN10874_ZH LFPAK MOSFET thermal design guide, Chinese version Application note 2020-04-30
AN11113_ZH LFPAK MOSFET thermal design guide - Part 2 Application note 2020-04-30
AN11158 Understanding power MOSFET data sheet parameters Application note 2020-07-06
AN11158_ZH Understanding power MOSFET data sheet parameters Application note 2021-01-04
AN11243 Failure signature of Electrical Overstress on Power MOSFETs Application note 2017-12-21
AN11261 RC Thermal Models Application note 2021-03-18
AN11599 Using power MOSFETs in parallel Application note 2016-07-13
SOT223 3D model for products with SOT223 package Design support 2019-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SC-73_SOT223_mk plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Marcom graphics 2017-01-28
SOT223 plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Package information 2022-05-30
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
BSP230 BSP230 SPICE model SPICE model 2012-06-08
BSP230_15_03_2012 BSP230.15_03_2012 Spice parameter SPICE model 2012-04-13
TN00008 Power MOSFET frequently asked questions and answers Technical note 2024-08-09
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
BSP230 BSP230 SPICE model SPICE model 2012-06-08
BSP230_15_03_2012 BSP230.15_03_2012 Spice parameter SPICE model 2012-04-13
SOT223 3D model for products with SOT223 package Design support 2019-01-22

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

交互式数据手册