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200 V, 2 A hyperfast PN-rectifier
High power density, hyperfast PN-rectifier with high-efficiency planar technology, encapsulated in a small and flat lead CFP5 (SOD128) Surface-Mounted Device (SMD) plastic package.
Features and benefits
- Reverse voltage VR ≤ 200 V
- Forward current IF ≤ 2 A
- Hyperfast recovery time trr ≤ 25 ns
- Pt doped life time control
- Low inductance
- Small and flat lead SMD plastic package
- Package height typ. 1 mm
- High power capability due to clip-bond technology
- Capable for reflow and wave soldering
- Planar die design
Applications
- General-purpose rectification
- Reverse polarity protection
- Hyperfast switching
- Freewheeling applications
参数类型
型号 | Package version | Package name | Size (mm) | VR [max] (V) | IF(AV) per diode; [max] (A) | IFSM [max] (A) | VF [max] (mV) | IR [max] (µA) | Configuration | trr [max] (ns) | IF [max] (mA) | Cd [typ] (pF) | Automotive qualified |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ES2DP | SOD128 | CFP5 | 3.8 x 2.5 x 1 | 200.0 | 2.0 | 46.0 | 950.0 | 0.2 | single | 25.0 | 2800.0 | 20.0 | N |
封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
ES2DP | ES2DPX (934070394115) |
Obsolete | DN |
CFP5 (SOD128) |
SOD128 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOD128_115 |
文档 (11)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
ES2DP | 200 V, 2 A hyperfast PN-rectifier | Data sheet | 2017-08-25 |
AN90002 | Wave soldering guidelines for flatpack packages | Application note | 2023-11-02 |
Nexperia_document_brochure_CFP_Schottky_rectifier | Schottky rectifiers in CFP packages | Brochure | 2020-01-28 |
Nexperia_Document_Leaflet_Schottky_rectifiers_in_CFP_CHN_2022 | CFP封装的肖特基整流器 | Leaflet | 2022-07-01 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
CFP5_SOD128_mk | plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body | Marcom graphics | 2017-01-28 |
SOD128 | plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body | Package information | 2022-05-27 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
ES2DP | ES2DP SPICE model | SPICE model | 2016-12-01 |
TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
ES2DP | ES2DP SPICE model | SPICE model | 2016-12-01 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.