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Integrated 4-channel ESD protection
The devices are designed to protect the capacitive loads of Input/Output (I/O) ports (such as USB 2.0, Ethernet, Digital Visual Interface (DVI), etc.) from being damaged by ElectroStatic Discharge (ESD).
To provide ESD protection to downstream signal and supply components, the devices incorporate four pairs of ultra low capacitance rail-to-rail diodes plus two Zener diodes. This provides protection against contact discharge voltages as high as ±8 kV in accordance with IEC 61000-4-2, level 4.
The ESD protection is independent of the supply voltage due to the rail-to-rail diodes being connected to a Zener diode.
The devices are fabricated using monolithic silicon technology and integrate four ultra low capacitance rail-to-rail ESD protection diodes plus two Zener diodes.
Features and benefits
- Pb-free and Restriction of Hazardous Substances (RoHS) compliant
- IEC 61000-4-2, level 4, ±8 kV contact discharge compliant ESD protection
- Four input ESD rail-to-rail protection diodes with ultra low input capacitance of 0.6 pF maximum
- Low-voltage clamping due to integrated Zener diodes
Applications
General-purpose downstream ESD protection high-frequency analog signals and high-speed serial data transmission for ports inside:
- PC/Notebook USB 2.0/IEEE 1394 ports
- Cellular phone and Personal Communication System (PCS) mobile handsets
- Digital Visual Interface (DVI)
- High-Definition Multimedia Interfaces (HDMI)
- Cordless telephones
- Wireless data (WAN/LAN) systems
- MID (Mobile Internet Device) and PMP (Portable Media Player)
参数类型
型号 | Package name |
---|---|
IP4286CZ6-TBF | XSON6 |
封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
IP4286CZ6-TBF | IP4286CZ6-TBF,115 (934063566115) |
Obsolete |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
文档 (9)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
IP4286CZ6-TBF_TTY | Integrated 4-channel ESD protection | Data sheet | 2010-09-17 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
支持
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模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.