双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

PBSS5630PA

30 V, 6 A PNP low VCEsat (BISS) transistor

PNP low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability.

NPN complement: PBSS4630PA.

Features and benefits

  • Low collector-emitter saturation voltage VCEsat

  • High collector current capability IC and ICM

  • Smaller required Printed-Circuit Board (PCB) area than for conventional transistors

  • Exposed heat sink for excellent thermal and electrical conductivity

  • Leadless small SMD plastic package with medium power capability

Applications

  • Loadswitch

  • Battery-driven devices

  • Power management

  • Charging circuits

  • Power switches (e.g. motors, fans)

参数类型

型号 Package version Package name Size (mm) channel type (e) Ptot (mW) VCEO [max] (V) IC [max] (mA) hFE [min] TJ [max] (°C) fT [min] (MHz) Automotive qualified
PBSS5630PA SOT1061 DFN2020-3 2 x 2 x 0.65 PNP 500.0 -30.0 -6000.0 230.0 150 50.0 N

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
PBSS5630PA PBSS5630PA,115
(934063496115)		 Active AB SOT1061
DFN2020-3
(SOT1061) 		SOT1061 REFLOW_BG-BD-1
SOT1061_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
PBSS5630PA PBSS5630PA,115 PBSS5630PA rohs rhf rhf
品质及可靠性免责声明

文档 (11)

文件名称 标题 类型 日期
PBSS5630PA 30 V, 6 A PNP low VCEsat (BISS) transistor Data sheet 2010-04-14
AN11045 Next generation of NXP low VCEsat transistors: improved technology for discrete semiconductors Application note 2013-03-04
AN11076 Thermal behavior of small-signal discretes on multilayer PCBs Application note 2021-06-23
SOT1061 3D model for products with SOT1061 package Design support 2022-06-02
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN2020-3_SOT1061_mk plastic, thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body Marcom graphics 2017-01-28
SOT1061 plastic, leadless thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body Package information 2022-05-27
SOT1061_115 DFN2020-3; Reel pack for SMD, 7"; Q2/T3 product orientation Packing information 2020-04-21
PBSS5630PA_Nexperia_Product_Reliability PBSS5630PA Nexperia Product Reliability Quality document 2024-04-23
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
PBSS5630PA PBSS5630PA SPICE model SPICE model 2024-08-27

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
PBSS5630PA PBSS5630PA SPICE model SPICE model 2024-08-27
SOT1061 3D model for products with SOT1061 package Design support 2022-06-02

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
PBSS5630PA PBSS5630PA,115 934063496115 Active SOT1061_115 3,000 订单产品

样品

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如果您没有 Nexperia 的直接账户，我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

交互式数据手册

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
PBSS5630PA PBSS5630PA,115 934063496115 SOT1061 订单产品