可订购部件
型号 | 可订购的器件编号 | 订购代码(12NC) | 封装 | 从经销商处购买 |
---|---|---|---|---|
PMEG2020EPAS | PMEG2020EPASX | 934068149115 | SOT1061D | 订单产品 |
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Click here for more information20 V, 2 A low VF Schottky barrier rectifier
Planar Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
Average forward current IF(AV) ≤ 2 A
Reverse voltage VR ≤ 20 V
Low forward voltage VF ≤ 420 mV
Low reverse current
Reduced Printed-Circuit-Board (PCB) area requirements
Exposed heat sink (cathode pad) for excellent thermal and electrical conductivity
Leadless small SMD plastic package with visible and solderable side pads
Suitable for Automatic Optical Inspection (AOI) of solder joints
Low voltage rectification
High efficiency DC-to-DC conversion
Switch Mode Power Supply (SMPS)
Free-wheeling application
Reverse polarity protection
Low power consumption application
Battery chargers for mobile equipment
LED backlight for mobile application
型号 | Package version | Package name | Size (mm) | VR [max] (V) | IF [max] (A) | Nr of functions | Configuration | VF [typ] @25 C (mV) | VF [max] (mV) | IR [typ] @25 C (µA) | IR [max] @25 C (µA) | Cd [max] (pF) | Remark | Automotive qualified |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PMEG2020EPAS | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | 20 | 2 | single | single | 385 | 420 | 335 | 1900 | 175 | solderable side pads | N |
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
PMEG2020EPAS | PMEG2020EPASX (934068149115) |
Active | CN |
DFN2020D-3 (SOT1061D) |
SOT1061D |
REFLOW_BG-BD-1
|
SOT1061D_115 |
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PMEG2020EPAS | 20 V, 2 A low VF MEGA Schottky barrier rectifier | Data sheet | 2017-05-04 |
AN90023 | Thermal performance of DFN packages | Application note | 2020-11-23 |
AN90023_ZH | Thermal performance of DFN packages | Application note | 2021-02-26 |
Nexperia_asset_document_brochure_autoDFN_CN_LR | 小巧轻便的汽车 二极管和晶体管 | Brochure | 2022-04-26 |
Nexperia_asset_document_brochure_autoDFN_CN_LR | 小巧轻便的汽车 二极管和晶体管 | Brochure | 2022-04-26 |
SOT1061D | 3D model for products with SOT1061D package | Design support | 2021-07-30 |
Nexperia_AutoDFN_factsheet_2022 | Small & light automotive diodes and transistors | Leaflet | 2022-04-13 |
Nexperia_AutoDFN_factsheet_2022 | Small & light automotive diodes and transistors | Leaflet | 2022-04-13 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN2020D-3_SOT1061D_mk | plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
SOT1061D | plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-10-10 |
SOT1061D_115 | DFN2020D-3; Reel pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2020-05-29 |
PMEG2020EPAS_Nexperia_Product_Reliability | PMEG2020EPAS Nexperia Product Reliability | Quality document | 2024-04-23 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
PMEG2020EPAS | PMEG2020EPAS SPICE Model | SPICE model | 2015-04-23 |
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文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PMEG2020EPAS | PMEG2020EPAS SPICE Model | SPICE model | 2015-04-23 |
SOT1061D | 3D model for products with SOT1061D package | Design support | 2021-07-30 |
型号 | Orderable part number | Ordering code (12NC) | 状态 | 包装 | Packing Quantity | 在线购买 |
---|---|---|---|---|---|---|
PMEG2020EPAS | PMEG2020EPASX | 934068149115 | Active | SOT1061D_115 | 3,000 | 订单产品 |
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The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.