可订购部件
| 型号 | 可订购的器件编号 | 订购代码(12NC) | 封装 | 从经销商处购买 |
|---|---|---|---|---|
| PMEG6045ETP | PMEG6045ETPX | 934067593115 | SOD128 | 订单产品 |
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Click here for more informationPMEG6045ETP
High-temperature 60 V, 4.5 A Schottky barrier rectifier
Planar Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package.
Alternatives
Features and benefits
Average forward current: IF(AV) ≤ 4.5 A
Reverse voltage: VR ≤ 60 V
Low forward voltage
High power capability due to clip-bonding technology
Small and flat lead SMD plastic package
High temperature Tj ≤ 175 °C
Suitable for both reflow and wave soldering
Applications
Low voltage rectification
High efficiency DC-to-DC conversion
Switch mode power supply
Reverse polarity protection
Low power consumption application
参数类型
| 型号 | Package version | Package name | Size (mm) | VR [max] (V) | IF [max] (A) | Nr of functions | Configuration | VF [typ] @25 C (mV) | VF [max] (mV) | IR [typ] @25 C (µA) | IR [max] @25 C (µA) | Cd [max] (pF) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG6045ETP | SOD128 | CFP5 | 3.8 x 2.5 x 1 | 60 | 4.5 | single | single | 460 | 530 | 115 | 400 | 575 | N |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| PMEG6045ETP | PMEG6045ETPX (934067593115) |
Active | DC |
CFP5 (SOD128) |
SOD128 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOD128_115 |
Boards
| Part number | Description | Type | Quick links | Shop link |
|---|---|---|---|---|
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描述 For ADAS and automotive electrification, functional safety is increasingly vital. NXP's evaluation board for the FS86 Safety SBC for domain control (ASIL B and D) highlights it's power capability, the safety integration and system scalability of domain controller applications to address multiple MCU requirements. Several Nexperia parts feature on this board.
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类型 Reference design
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Quick links
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Shop link
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描述 For ADAS and automotive electrification, functional safety is increasingly vital. NXP's evaluation board for the FS86 Safety SBC for domain control (ASIL B and D) highlights it's power capability, the safety integration and system scalability of domain controller applications to address multiple MCU requirements. Several Nexperia parts feature on this board.
|
类型 Reference design
|
Quick links
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Shop link
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文档 (19)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| PMEG6045ETP | High-temperature 60 V, 4.5 A Schottky barrier rectifier | Data sheet | 2023-02-20 |
| AN10808 | Thermal consideration of NXP FlatPower MEGA Schottky barrier rectifiers - Selection criteria | Application note | 2015-04-29 |
| AN11310 | FlatPower Schottky rectifier in low power adapter | Application note | 2013-04-08 |
| AN11358 | Parallel Schottkys as secondary rectifiers in flyback adapter: power losses and junction temperatures | Application note | 2015-03-06 |
| AN90002 | Wave soldering guidelines for flatpack packages | Application note | 2023-11-02 |
| Nexperia_document_brochure_CFP_Schottky_rectifier | Schottky rectifiers in CFP packages | Brochure | 2020-01-28 |
| Nexperia_document_brochure_CFP_Schottky_rectifier | Schottky rectifiers in CFP packages | Brochure | 2020-01-28 |
| Nexperia_Document_Leaflet_Schottky_rectifiers_in_CFP_CHN_2022 | CFP封装的肖特基整流器 | Leaflet | 2022-07-01 |
| Nexperia_Document_Leaflet_Schottky_rectifiers_in_CFP_CHN_2022 | CFP封装的肖特基整流器 | Leaflet | 2022-07-01 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| CFP5_SOD128_mk | plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOD128 | plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body | Package information | 2022-05-27 |
| SOD128_115 | Reel pack for SMD, 7''; Q1/T1-Q2/T3 product orientation | Packing information | 2020-06-11 |
| PMEG6045ETP_Nexperia_Product_Reliability | PMEG6045ETP Nexperia Product Reliability | Quality document | 2024-04-23 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| PMEG6045ETP | PMEG6045ETP SPICE model | SPICE model | 2016-05-09 |
| TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
| TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。
模型
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| PMEG6045ETP | PMEG6045ETP SPICE model | SPICE model | 2016-05-09 |
订购、定价与供货
| 型号 | Orderable part number | Ordering code (12NC) | 状态 | 包装 | Packing Quantity | 在线购买 |
|---|---|---|---|---|---|---|
| PMEG6045ETP | PMEG6045ETPX | 934067593115 | Active | SOD128_115 | 3,000 | 订单产品 |
样品
作为 Nexperia 的客户，您可以通过我们的销售机构订购样品。
如果您没有 Nexperia 的直接账户，我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.
PMEG6045ETP
High-temperature 60 V, 4.5 A Schottky barrier rectifier
从安世半导体购买
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