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ESD protection for high-speed interfaces
The device is designed to protect high-speed interfaces such as USB 2.0 ports against ElectroStatic Discharge (ESD).
The device includes four high-level ESD protection diode structures for high-speed signal lines. It is encapsulated in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package.
All signal lines are protected by a special diode configuration offering ultra low line capacitance of 0.85 pF maximum. This configuration provides protection to downstream components from ESD voltages up to ±12 kV contact according to IEC 61000-4-2, level 4.
Features and benefits
- System ESD protection for USB 2.0
- All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection of ±12 kV according to IEC 61000-4-2, level 4
- Line capacitance of 0.85 pF maximum for each channel
Applications
The device is designed for receiver and transmitter port protection in:
- Portable devices
- TVs and monitors
- DVD recorders and players
- Notebooks, mother boards, graphic cards and ports
- Set-top boxes and game consoles
参数类型
型号 | Package name |
---|---|
PUSB2X4Y | TSSOP6 |
封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
PUSB2X4Y | PUSB2X4YH (934067937125) |
Withdrawn / End-of-life | PK% |
TSSOP6 (SOT363) |
SOT363 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT363_125 |
文档 (12)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PUSB2X4Y | ESD protection for high-speed interfaces | Data sheet | 2020-04-28 |
AN90032 | Low temperature soldering, application study | Application note | 2022-02-22 |
Nexperia_document_brochure_ESD-Protection-Applications_022017 | ESD Protection Application guide | Brochure | 2018-12-21 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
SOT363 | 3D model for products with SOT363 package | Design support | 2018-12-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP6_SOT363_mk | plastic, surface-mounted package; 6 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2017-01-28 |
SOT363 | plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body | Package information | 2022-06-01 |
PUSB2X4Y_Nexperia_Product_Reliability | PUSB2X4Y Nexperia Product Reliability | Quality document | 2021-03-19 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT363 | MAR_SOT363 Topmark | Top marking | 2013-06-03 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT363 | 3D model for products with SOT363 package | Design support | 2018-12-05 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.