特性
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Wide supply voltage range from 1.65 V to 5.5 V
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Overvoltage tolerant inputs to 5.5 V
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High noise immunity
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±24 mA output drive (VCC = 3.0 V)
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CMOS low power dissipation
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Direct interface with TTL levels
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IOFF circuitry provides partial Power-down mode operation at output Y
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Latch-up performance exceeds 250 mA
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Complies with JEDEC standard:
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JESD8-7 (1.65 V to 1.95 V)
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JESD8-5 (2.3 V to 2.7 V)
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JESD8C (2.7 V to 3.6 V)
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JESD36 (4.5 V to 5.5 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Specified from -40 °C to +85 °C and -40 °C to +125 °C
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74LVC1GX04GV | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 24 | 2.8 | 150 | 1 | low | -40~125 | 232 | 39.4 | 145 | TSOP6 |
74LVC1GX04GW | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 24 | 2.8 | 150 | 1 | low | -40~125 | 264 | 38.4 | 153 | TSSOP6 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74LVC1GX04GV | TSOP6 (SOT457) | SOT457 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT457_125 | Active | VX4 | 74LVC1GX04GV,125 ( 9352 740 25125 ) |
74LVC1GX04GW | TSSOP6 (SOT363) | SOT363 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT363_125 | Active | VX | 74LVC1GX04GW,125 ( 9352 740 24125 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74LVC1GX04GV | 74LVC1GX04GV,125 | 74LVC1GX04GV | Always Pb-free | ||
74LVC1GX04GW | 74LVC1GX04GW,125 | 74LVC1GX04GW | Always Pb-free |
文档 (11)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVC1GX04 | X-tal driver | Data sheet | 2023-09-07 |
Nexperia_document_Logic_CombinationLogic_infocard_201710 | Combination logic solutions card | Leaflet | 2017-10-16 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT363 | MAR_SOT363 Topmark | Top marking | 2013-06-03 |
SOT363 | plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body | Package information | 2022-06-01 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
支持
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