特性
-
Wide supply voltage range:
-
VCCI: 0.9 V to 5.5 V
-
VCCO: 0.9 V to 5.5 V
-
-
Low input capacitance; CI = 1.5 pF (typical)
-
Low output capacitance; CO = 3.8 pF (typical)
-
Low dynamic power consumption; CPD = 0.4 pF at VCCI = 1.2 V (typical)
-
Low dynamic power consumption; CPD = 11 pF at VCCO = 5 V (typical)
-
Low static power consumption; ICCI = 0.1 µA (25 °C maximum)
-
Low static power consumption; ICCO = 1.0 µA (25 °C maximum)
-
High noise immunity
-
Complies with JEDEC standard:
-
JESD8-12 (1.1 V to 1.3 V; A input)
-
JESD8-11 (1.4 V to 1.6 V)
-
JESD8-7 (1.65 V to 1.95 V)
-
JESD8-5 (2.3 V to 2.7 V)
-
JESD8C (2.7 V to 3.6 V)
-
JESD12-6 (4.5 V to 5.5 V)
-
-
ESD protection:
-
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
-
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
-
-
Latch-up performance exceeds 100 mA per JESD78D Class II
-
Inputs accept voltages up to 5.5 V
-
Low noise overshoot and undershoot < 10% of VCCO
-
IOFF circuitry provides partial power-down mode operation
-
Multiple package options
-
Specified from −40 °C to +125 °C
参数类型
Type number | Product status | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | Category |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
AXP1T34GM | Production | 0.9 - 5.5 | 0.9 - 5.5 | CMOS | ± 12 | 9 | 1 | ultra low | -40~125 | 304 | 7.3 | 153 | XSON6 | Uni-directional |
AXP1T34GS | Production | 0.9 - 5.5 | 0.9 - 5.5 | CMOS | ± 12 | 9 | 1 | ultra low | -40~125 | 304 | 24.0 | 202 | XSON6 | Uni-directional |
AXP1T34GW | Production | 0.9 - 5.5 | 0.9 - 5.5 | CMOS | ± 12 | 9 | 1 | ultra low | -40~125 | 300 | 72.0 | 172 | TSSOP5 | Uni-directional |
AXP1T34GX | Production | 0.9 - 5.5 | 0.9 - 5.5 | CMOS | ± 12 | 9 | 1 | ultra low | -40~125 | 303 | 75.0 | 175 | X2SON5 | Uni-directional |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
AXP1T34GM | XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_115 | Active | r3 | AXP1T34GMX ( 9356 916 27115 ) |
AXP1T34GS | XSON6 (SOT1202) | SOT1202 | REFLOW_BG-BD-1 | SOT1202_125 | Active | r3 | AXP1T34GSH ( 9356 916 26125 ) |
AXP1T34GW | TSSOP5 (SOT353-1) | SOT353-1 | WAVE_BG-BD-1 | SOT353-1_125 | Active | r3 | AXP1T34GWH ( 9356 916 24125 ) |
AXP1T34GX | X2SON5 (SOT1226-3) | SOT1226-3 | SOT1226-3_125 | Active | r3 | AXP1T34GXH ( 9356 915 73125 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
AXP1T34GM | AXP1T34GMX | AXP1T34GM | |||
AXP1T34GS | AXP1T34GSH | AXP1T34GS | |||
AXP1T34GW | AXP1T34GWH | AXP1T34GW | |||
AXP1T34GX | AXP1T34GXH | AXP1T34GX |
文档 (10)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
AXP1T34 | Dual supply translating buffer | Data sheet | 2023-12-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
SOT1226-3 | plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表, 我们会尽快回复您。