参数类型
| 型号 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC8T595BQ | 1.1 - 5.5 | 1.1 - 5.5 | CMOS/LVTTL | ± 24 | 4.1 | 8 | low | -40~125 | DHVQFN20 | Uni-directional |
| 74LVC8T595PW | 1.1 - 5.5 | 1.1 - 5.5 | CMOS/LVTTL | ± 24 | 4.1 | 8 | low | -40~125 | TSSOP20 | Uni-directional |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74LVC8T595BQ | 74LVC8T595BQX (935309143115) |
Active | LVC8T595 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74LVC8T595PW | 74LVC8T595PWJ (935309144118) |
Active | VC8T595 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC8T595BQ | 74LVC8T595BQX | 74LVC8T595BQ |
|
|
| 74LVC8T595PW | 74LVC8T595PWJ | 74LVC8T595PW |
|
|
文档 (12)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74LVC8T595 | Dual supply 8-bit serial-in/serial-out or parallel-out shift register; 3-state | Data sheet | 2023-08-29 |
| Nexperia_document_guide_Logic_translators | Nexperia Logic Translators | Brochure | 2021-04-12 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| Nexperia_document_leaflet_Logic_74LVC8T595_201711 | Voltage-translating Shift Register for Modular Designs | Leaflet | 2017-11-29 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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