You are invited to the third session of Nexperia’s Power Rectifier Webinar Series where Nexperia will explain the importance of clip flat power packages in the context of downsizing and PCB design. The right package choice is not only essential when it comes to availability and long-term supply security. The increasing demand for miniaturization leads to more compact board designs and therefore the thermal power dissipation is becoming a real challenge for designers. Nexperia will help you to understand the concept of the thermal resistance R_th in depth. Furthermore, temperature differences between conventional SMX and CFP rectifier packages are investigated and compared with regards to downsizing potential and board layout. In this webinar you will learn how to make the most out of your design with flat power packages.

You will learn about:

• Power Rectifier packages are introduced
• Concept of R_th and the total power dissipation is explained
• Surrounding conditions of the thermal design are examined: Optimal footprint design, layout and printed circuit board
• Benchmarking of different packages (SMx vs. CFP)