双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LVC1G240

Single inverting buffer/line driver; 3-state

The 74LVC1G240 is a 1-bit inverting buffer/line driver with 3-state output. The device features an output enable OE. A HIGH on OE causes the output to assume a high-impedance OFF-state. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range from 1.65 V to 5.5 V

  • Overvoltage tolerant inputs to 5.5 V

  • High noise immunity

  • CMOS low power dissipation

  • IOFF circuitry provides partial Power-down mode operation

  • ±24 mA output drive (VCC = 3.0 V)

  • Latch-up performance exceeds 250 mA

  • Direct interface with TTL levels

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Package name
74LVC1G240GM 1.65 - 5.5 CMOS/LVTTL ± 32 175 1 low -40~125 XSON6
74LVC1G240GS 1.65 - 5.5 CMOS/LVTTL ± 32 175 1 low -40~125 XSON6
74LVC1G240GW 1.65 - 5.5 CMOS/LVTTL ± 32 175 1 low -40~125 TSSOP5
74LVC1G240GX 1.65 - 5.5 CMOS/LVTTL ± 32 175 1 low -40~125 X2SON5

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC1G240GM 74LVC1G240GM,115
(935277205115)		 Active V2 SOT886
XSON6
(SOT886) 		SOT886 REFLOW_BG-BD-1
SOT886_115
74LVC1G240GS 74LVC1G240GSH
(935691254125)		 Active V2 SOT1202
XSON6
(SOT1202) 		SOT1202 REFLOW_BG-BD-1
暂无信息
74LVC1G240GW 74LVC1G240GWH
(935691562125)		 Active V2 SOT353-1
TSSOP5
(SOT353-1) 		SOT353-1 WAVE_BG-BD-1
SOT353-1_125
74LVC1G240GX 74LVC1G240GXH
(935691255125)		 Active V2 SOT1226-3
X2SON5
(SOT1226-3) 		SOT1226-3 SOT1226-3_125

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC1G240GM 74LVC1G240GM,115 74LVC1G240GM rohs rhf rhf
74LVC1G240GS 74LVC1G240GSH 74LVC1G240GS rohs rhf rhf
74LVC1G240GW 74LVC1G240GWH 74LVC1G240GW rohs rhf rhf
74LVC1G240GX 74LVC1G240GXH 74LVC1G240GX rohs rhf rhf
品质及可靠性免责声明

文档 (20)

文件名称 标题 类型 日期
74LVC1G240 Single inverting buffer/line driver; 3-state Data sheet 2023-11-01
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
SOT1226-3 3D model for products with SOT1226-3 package Design support 2021-01-28
lvc1g240 74LVC1G240 IBIS model IBIS model 2021-07-29
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
TSSOP5_SOT353-1_mk plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body Marcom graphics 2018-07-25
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT1202 plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body Package information 2022-06-01
SOT353-1 plastic thin shrink small outline package; 5 leads; body width 1.25 mm Package information 2022-11-15
SOT1226-3 plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm Package information 2020-08-27
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03
MAR_SOT1202 MAR_SOT1202 Topmark Top marking 2013-06-03
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

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模型

文件名称 标题 类型 日期
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
SOT1226-3 3D model for products with SOT1226-3 package Design support 2021-01-28
lvc1g240 74LVC1G240 IBIS model IBIS model 2021-07-29

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