Features and Benefits
- 60% lower parasitic inductance due to internal clip connection
- 30% space saving on PCB compared to LFPAK56D dual
- High performance ID max >60 A
- Low thermal resistance
- Flexible leads for BLR
- Footprint compatible with LFPAK56D dual
- External leads for easy AOI
- Beyond AEC-Q101 for automotive products
Applications
- 3-phase automotive power train applications
- Fuel, oil and water pumps
- Motor control
- DC/DC
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参数搜索
产品
型号 | 描述 | 状态 | 快速访问 |
---|---|---|---|
BUK7V4R2-40H | Dual N-channel 40 V, 4.2 mOhm standard level MOSFET in LFPAK56D (half-bridge configuration) | Production | |
BUK9V13-40H | Dual N-channel 40 V, 13 mOhm logic level MOSFET in LFPAK56D (half-bridge configuration) | Production |
Application note (2) |
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文件名称 | 标题 | 类型 | 日期 |
AN90003.pdf | LFPAK MOSFET thermal design guide | Application note | 2023-08-22 |
AN90011.pdf | Half-bridge MOSFET switching and its impact on EMC | Application note | 2020-04-28 |
Marcom graphics (1) |
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文件名称 | 标题 | 类型 | 日期 |
RS3408.jpg | Automotive water pump MARCOM image | Marcom graphics | 2021-11-25 |
Selection guide (1) |
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文件名称 | 标题 | 类型 | 日期 |
Nexperia_Selection_guide_2023.pdf | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SPICE model (2) |
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文件名称 | 标题 | 类型 | 日期 |
BUK9V13-40H.lib | BUK9V13-40H SPICE model | SPICE model | 2021-02-09 |
BUK7V4R2-40H.lib | BUK7V4R2-40H SPICE model | SPICE model | 2021-02-09 |
Thermal model (4) |
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文件名称 | 标题 | 类型 | 日期 |
BUK9V13-40H_Foster.lib | BUK9V13-40H Foster thermal model | Thermal model | 2021-02-09 |
BUK9V13-40H_Cauer.lib | BUK9V13-40H Cauer thermal model | Thermal model | 2021-02-09 |
BUK7V4R2-40H_Foster.lib | BUK7V4R2-40H Foster thermal model | Thermal model | 2021-02-09 |
BUK7V4R2-40H_Cauer.lib | BUK7V4R2-40H Cauer thermal model | Thermal model | 2021-02-09 |