参数类型
型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
74LVC377D | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 6.0 | 230 | low | -40~125 | SO20 |
74LVC377PW | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 6.0 | 230 | low | -40~125 | TSSOP20 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74LVC377D | 74LVC377D,118 (935210660118) |
Active | 74LVC377D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
74LVC377PW | 74LVC377PW,118 (935210680118) |
Active | LVC377 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74LVC377DB | 74LVC377DB,112 (935210670112) |
Obsolete | no package information | ||||
74LVC377DB,118 (935210670118) |
Obsolete | ||||||
74LVC377PW | 74LVC377PW,112 (935210680112) |
Withdrawn / End-of-life | LVC377 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
暂无信息 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVC377D | 74LVC377D,118 | 74LVC377D | ||
74LVC377PW | 74LVC377PW,118 | 74LVC377PW |
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVC377DB | 74LVC377DB,112 | 74LVC377DB | ||
74LVC377DB | 74LVC377DB,118 | 74LVC377DB | ||
74LVC377PW | 74LVC377PW,112 | 74LVC377PW |
文档 (14)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVC377 | Octal D-type flip-flop with data enable; positive-edge trigger | Data sheet | 2023-08-28 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
lvc377 | lvc377 IBIS model | IBIS model | 2013-04-09 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2022-06-20 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
lvc | lvc Spice model | SPICE model | 2013-05-07 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
Ordering, pricing & availability
样品
作为 Nexperia 的客户,您可以通过我们的销售机构订购样品。
如果您没有 Nexperia 的直接账户,我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。