参数类型
| 型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|
| 74AHC1G02GV | 2.0 - 5.5 | CMOS | ± 8 | 3.2 | 60 | 1 | low | -40~125 | TSOP5 |
| 74AHC1G02GW | 2.0 - 5.5 | CMOS | ± 8 | 3.2 | 60 | 1 | low | -40~125 | TSSOP5 |
| 74AHCT1G02GV | 4.5 - 5.5 | TTL | ± 8 | 3.5 | 60 | 1 | low | -40~125 | TSOP5 |
| 74AHCT1G02GW | 4.5 - 5.5 | TTL | ± 8 | 3.5 | 60 | 1 | low | -40~125 | TSSOP5 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74AHC1G02GV | 74AHC1G02GV,125 (935271650125) |
Active | A02 |
TSOP5 (SOT753) |
SOT753 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT753_125 |
| 74AHC1G02GW | 74AHC1G02GW,125 (935262750125) |
Active | AB |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
| 74AHCT1G02GV | 74AHCT1G02GV,125 (935271651125) |
Active | C02 |
TSOP5 (SOT753) |
SOT753 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT753_125 |
| 74AHCT1G02GW | 74AHCT1G02GW,125 (935262751125) |
Active | CB |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC1G02GV | 74AHC1G02GV,125 | 74AHC1G02GV |
|
|
| 74AHC1G02GW | 74AHC1G02GW,125 | 74AHC1G02GW |
|
|
| 74AHCT1G02GV | 74AHCT1G02GV,125 | 74AHCT1G02GV |
|
|
| 74AHCT1G02GW | 74AHCT1G02GW,125 | 74AHCT1G02GW |
|
|
文档 (14)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74AHC_AHCT1G02 | 2-input NOR gate | Data sheet | 2024-09-19 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| ahc1g02 | ahc1g02 IBIS model | IBIS model | 2013-04-08 |
| ahct1g02 | ahct1g02 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。
Ordering, pricing & availability
样品
作为 Nexperia 的客户，您可以通过我们的销售机构订购样品。
如果您没有 Nexperia 的直接账户，我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。