双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74AUP3G34

Low-power triple buffer

The 74AUP3G34 is a triple buffer.

Schmitt trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial Power-down applications using IOFF. The IOFF circuitry disables the output, preventing a damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range from 0.8 V to 3.6 V

  • High noise immunity

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD 78B Class II

  • Inputs accept voltages up to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Package name
74AUP3G34DC 0.8 - 3.6 CMOS ± 1.9 70 3 ultra low -40~125 VSSOP8
74AUP3G34GN 0.8 - 3.6 CMOS ± 1.9 70 3 ultra low -40~125 XSON8
74AUP3G34GS 0.8 - 3.6 CMOS ± 1.9 70 3 ultra low -40~125 XSON8
74AUP3G34GT 0.8 - 3.6 CMOS ± 1.9 70 3 ultra low -40~125 XSON8
74AUP3G34GX 0.8 - 3.6 CMOS ± 1.9 70 3 ultra low -40~125 X2SON8

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74AUP3G34DC 74AUP3G34DCH
(935280694125)		 Active a34 SOT765-1
VSSOP8
(SOT765-1) 		SOT765-1 SOT765-1_125
74AUP3G34GN 74AUP3G34GNX
(935305159115)		 Active aA SOT1116
XSON8
(SOT1116) 		SOT1116 REFLOW_BG-BD-1
SOT1116_115
74AUP3G34GS 74AUP3G34GSX
(935305161115)		 Active aA SOT1203
XSON8
(SOT1203) 		SOT1203 REFLOW_BG-BD-1
SOT1203_115
74AUP3G34GT 74AUP3G34GTX
(935280695115)		 Active a34 SOT833-1
XSON8
(SOT833-1) 		SOT833-1 SOT833-1_115
74AUP3G34GX 74AUP3G34GXX
(935339794115)		 Active aA SOT1233-2
X2SON8
(SOT1233-2) 		SOT1233-2 SOT1233-2_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74AUP3G34DC 74AUP3G34DCH 74AUP3G34DC rohs rhf rhf
74AUP3G34GN 74AUP3G34GNX 74AUP3G34GN rohs rhf rhf
74AUP3G34GS 74AUP3G34GSX 74AUP3G34GS rohs rhf rhf
74AUP3G34GT 74AUP3G34GTX 74AUP3G34GT rohs rhf rhf
74AUP3G34GX 74AUP3G34GXX 74AUP3G34GX rohs rhf rhf
品质及可靠性免责声明

文档 (24)

文件名称 标题 类型 日期
74AUP3G34 Low-power triple buffer Data sheet 2024-04-29
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT765-1 3D model for products with SOT765-1 package Design support 2020-01-22
SOT1116 3D model for products with SOT1116 package Design support 2023-02-02
SOT1203 3D model for products with SOT1203 package Design support 2023-02-02
SOT833-1 3D model for products with SOT833-1 package Design support 2021-01-28
SOT1233-2 3D model for products with SOT1233-2 package Design support 2021-01-28
aup3g34 74AUP3G34 IBIS Model IBIS model 2014-12-05
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Leaflet 2019-04-12
Nexperia_document_leaflet_Logic_X2SON_packages_062018 X2SON ultra-small 4, 5, 6 & 8-pin leadless packages Leaflet 2018-06-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
VSSOP8_SOT765-1_mk plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body Marcom graphics 2017-01-28
XSON8_SOT1203_mk plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body Marcom graphics 2019-02-04
SOT765-1 plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body Package information 2022-06-03
SOT1116 plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body Package information 2022-06-02
SOT1203 plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body Package information 2022-06-03
SOT833-1 plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body Package information 2022-06-03
SOT1233-2 plastic thermal enhanced extremely thin small outline package; no leads;8 terminals; body 1.35 x 0.8 x 0.32 mm Package information 2022-04-21
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
MAR_SOT1116 MAR_SOT1116 Topmark Top marking 2013-06-03
MAR_SOT1203 MAR_SOT1203 Topmark Top marking 2013-06-03
MAR_SOT833 MAR_SOT833 Topmark Top marking 2013-06-03

支持

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模型

文件名称 标题 类型 日期
SOT765-1 3D model for products with SOT765-1 package Design support 2020-01-22
SOT1116 3D model for products with SOT1116 package Design support 2023-02-02
SOT1203 3D model for products with SOT1203 package Design support 2023-02-02
SOT833-1 3D model for products with SOT833-1 package Design support 2021-01-28
SOT1233-2 3D model for products with SOT1233-2 package Design support 2021-01-28
aup3g34 74AUP3G34 IBIS Model IBIS model 2014-12-05

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