双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

化学成分 74HCT4051BQ

作为一家积极进取的可持续发展公司,安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息,恩智浦可以向我们的客户提供相关资料,以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据,这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
93527742311574HCT4051BQ,11574HCT4051BQSOT763 (DHVQFN16)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 2 ppm; substance 7440-02-0: 5871 ppm; substance 1333-86-4: 834 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 2 ppm; substance 7440-02-0: 5871 ppm; substance 1333-86-4: 834 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 2822 ppm; substance 7440-57-5: 146 ppm; substance 7440-05-3: 78 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.06075075.0000000.272977
AdhesivePolymerResin system0.01458018.0000000.065515
AdhesivePolymerAcrylic resin0.0048606.0000000.021838
AdhesiveAdditiveNon hazardous0.0008101.0000000.003640
Adhesive Total0.081000100.0000000.363970
DieDoped siliconSilicon (Si)7440-21-30.580764100.0000002.609639
Die Total0.580764100.0000002.609639
Lead FrameCopper alloyCopper (Cu)7440-50-89.82040896.09950044.127591
Lead FrameCopper alloyIron (Fe)7439-89-60.2370822.3200001.065315
Lead FrameCopper alloyZinc (Zn)7440-66-60.0122630.1200000.055104
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0081760.0800000.036737
Lead FrameGold alloyGold (Au)7440-57-50.0030640.0299700.013764
Lead FrameGold alloySilver (Ag)7440-22-40.0020420.0199800.009177
Lead FrameImpurityNon hazardous0.0001310.0012800.000590
Lead FrameCopper alloyLead (Pb)7439-92-10.0000510.0005000.000232
Lead FrameImpurityNon hazardous0.0000060.0000500.000025
Lead FramePure metal layerNickel (Ni)7440-02-00.1306721.2787200.587173
Lead FramePure metal layerCopper (Cu)7440-50-80.0051050.0499500.022938
Lead Frame Total10.219000100.00000045.918646
Mould CompoundFillerSilica fused60676-86-09.59992884.82000043.136870
Mould CompoundPolymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4188793.7010001.882216
Mould CompoundFillerSilica -amorphous-7631-86-90.3949983.4900001.774908
Mould CompoundAdditiveNon hazardous0.3377292.9840001.517572
Mould CompoundPolymerPhenolic resin0.2549952.2530001.145807
Mould CompoundPolymerEpoxy resin system0.1795031.5860000.806591
Mould CompoundFlame retardantFlame retardant, organic phosphorus compound0.1134061.0020000.509587
Mould CompoundPigmentCarbon black1333-86-40.0185620.1640000.083405
Mould Compound Total11.318000100.00000050.856956
WirePure metalCopper (Cu)7440-50-80.05388796.5500000.242137
WirePure metal layerPalladium (Pd)7440-05-30.0017303.1000000.007775
WirePure metal layerGold (Au)7440-57-50.0001950.3500000.000877
Wire Total0.055812100.0000000.250789
74HCT4051BQ Total22.254576100.000000100.000000
Notes
Report created on 2024-10-26 17:42:11 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-10-26 17:42:11 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)
半导体芯片 (Die)
引线框架 (Lead Frame)
模封料 (Mould Compound)
导线 (Wire)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-10-26 17:42:11 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.