化学成分 BC817RAPN

作为一家积极进取的可持续发展公司，安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息，恩智浦可以向我们的客户提供相关资料，以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据，这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934070166147	BC817RAPNZ	BC817RAPN	SOT1268 (DFN1412-6)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 13767 ppm; substance 1333-86-4: 2328 ppm; substance 7439-92-1: <1 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 13767 ppm; substance 1333-86-4: 2328 ppm; substance 7439-92-1: <1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 43858 ppm; substance 7440-57-5: 6639 ppm; substance 7440-05-3: 141 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Adhesive	Filler	Silver (Ag)	7440-22-4	0.106400	76.000000	4.385820
Adhesive	Polymer	Phenolic resin		0.018942	13.530000	0.780791
Adhesive	Polymer	Formaldehyde, polymer with (chloromethyl)oxirane and phenol	9003-36-5	0.014658	10.470000	0.604205
		Adhesive Total		0.140000	100.000000	5.770816

Die 2	Doped silicon	Silicon (Si)	7440-21-3	0.080000	100.000000	3.297609
		Die Total		0.080000	100.000000	3.297609
		Die 2 Total		0.080000	100.000000	3.297609

Die 1	Doped silicon	Silicon (Si)	7440-21-3	0.050000	100.000000	2.061006
		Die Total		0.050000	100.000000	2.061006
		Die 1 Total		0.050000	100.000000	2.061006

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	0.918509	95.678000	37.861039
Lead Frame	Copper alloy	Nickel (Ni)	7440-02-0	0.028644	2.983700	1.180689
Lead Frame	Copper alloy	Silicon (Si)	7440-21-3	0.006206	0.646500	0.255829
Lead Frame	Copper alloy	Magnesium (Mg)	7439-95-4	0.001432	0.149200	0.059040
		Base Alloy Total		0.954791	99.457400	39.356597
Lead Frame	Pure metal layer	Gold (Au)	7440-57-5	0.000109	0.011400	0.004511
		Pre-Plating 1 Total		0.000109	0.011400	0.004511
Lead Frame	Pure metal layer	Palladium (Pd)	7440-05-3	0.000343	0.035700	0.014127
		Pre-Plating 2 Total		0.000343	0.035700	0.014127
Lead Frame	Pure metal layer	Nickel (Ni)	7440-02-0	0.004757	0.495500	0.196076
		Pre-Plating 3 Total		0.004757	0.495500	0.196076
		Lead Frame Total		0.960000	100.000000	39.571311

Mould Compound	Filler	Silica fused	60676-86-0	0.678000	60.000000	27.947237
Mould Compound	Filler	Silica	7631-86-9	0.259900	23.000000	10.713108
Mould Compound	Polymer	Epoxy resin system		0.079100	7.000000	3.260511
Mould Compound	Polymer	Phenolic resin		0.067800	6.000000	2.794724
Mould Compound	Flame retardant	Aluminium hydroxide (Al(OH)3)	21645-51-2	0.033900	3.000000	1.397362
Mould Compound	Pigment	Carbon black	1333-86-4	0.005650	0.500000	0.232894
Mould Compound	Ion trapping agent	Bismuth (Bi)	7440-69-9	0.005650	0.500000	0.232894
		Mould Compound Total		1.130000	100.000000	46.578730

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.049970	99.940000	2.059769
Post-Plating	Impurity	Non-declarable		0.000028	0.055500	0.001144
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000002	0.004500	0.000093
		Post-Plating Total		0.050000	100.000000	2.061006

Wire	Pure metal	Gold (Au)	7440-57-5	0.015998	99.990000	0.659456
Wire	Impurity	Non-declarable		0.000002	0.010000	0.000066
		Wire Total		0.016000	100.000000	0.659522

		BC817RAPN Total		2.426000	100.000000	100.000000

Notes
Report created on 2024-12-18 14:34:05 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2024-12-18 14:34:05 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名称 Material	有毒或有害物质和元素 (Toxic or hazardous substances and elements)
部件名称 Material	铅 (Pb)	镉 (Cd)	汞 (Hg)	六价铬 (Cr⁶⁺)	多溴联苯 (PBB)	多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)	◯	◯	◯	◯	◯	◯
半导体芯片 (Die)	◯	◯	◯	◯	◯	◯
半导体芯片 (Die)	◯	◯	◯	◯	◯	◯
基底合金 (Base Alloy)	◯	◯	◯	◯	◯	◯
预镀层1 (Pre-Plating 1)	◯	◯	◯	◯	◯	◯
预镀层2 (Pre-Plating 2)	◯	◯	◯	◯	◯	◯
预镀层3 (Pre-Plating 3)	◯	◯	◯	◯	◯	◯
模封料 (Mould Compound)	◯	◯	◯	◯	◯	◯
后镀层 (Post-Plating)	◯	◯	◯	◯	◯	◯
导线 (Wire)	◯	◯	◯	◯	◯	◯

◯	表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
✕	表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	该半导体产品具有无限期的环保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2024-12-18 14:34:05 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

所有产品

双极性晶体管

二极管

ESD保护、TVS、信号调节

MOSFET

SiC MOSFETs

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车

所有应用

汽车

工业和电力

移动和可穿戴应用

计算和消费电子

Sub-systems: Power conversion topologies

子系统

参考设计

评估板

Interactive application notes

Advanced Support Tools

化学成分 BC817RAPN

双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

化学成分 BC817RAPN