化学成分 NEX5204100BY

作为一家积极进取的可持续发展公司，安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息，恩智浦可以向我们的客户提供相关资料，以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据，这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
935692281518	NEX5204100BYY	NEX5204100BY	SOT8041-2 (HWQFN24)	RFS	3

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 2158 ppm; substance 7439-92-1: <1 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 2158 ppm; substance 7439-92-1: <1 ppm; substance 7440-43-9: <1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 24327 ppm; substance 7440-57-5: 4 ppm; substance 7440-05-3: 43 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Adhesive	Filler	Silver (Ag)	7440-22-4	0.372362	77.900000	1.014738
Adhesive	Polymer	Acrylic resin		0.072656	15.200000	0.197998
Adhesive	Polymer	Resin system		0.032982	6.900000	0.089880
		Adhesive Total		0.478000	100.000000	1.302616

Die	Doped silicon	Silicon (Si)	7440-21-3	1.857024	99.840000	5.060645
Die	Pure metal layer	Tungsten (W)	7440-33-7	0.001116	0.060000	0.003041
		Die Metallization 1 Total		0.001116	0.060000	0.003041
Die	Pure metal layer	Aluminium (Al)	7429-90-5	0.001488	0.080000	0.004055
		Die Metallization 2 Total		0.001488	0.080000	0.004055
Die	Pure metal layer	Titanium (Ti)	7440-32-6	0.000372	0.020000	0.001014
		Die Metallization 3 Total		0.000372	0.020000	0.001014
		Die Total		1.860000	100.000000	5.068755

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	16.390080	94.500000	44.665217
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	0.402381	2.320000	1.096544
Lead Frame	Copper alloy	Zinc (Zn)	7440-66-6	0.017344	0.100000	0.047265
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.013875	0.080000	0.037811
Lead Frame	Pure metal layer	Silver (Ag)	7440-22-4	0.520320	3.000000	1.417943
		Pre-Plating Total		0.520320	3.000000	1.417943
		Lead Frame Total		17.344000	100.000000	47.264780

Mould Compound	Filler	Silica fused	60676-86-0	13.860000	87.500000	37.770402
Mould Compound	Filler	Silica	7631-86-9	0.950400	6.000000	2.589970
Mould Compound	Polymer	Epoxy resin system		0.633600	4.000000	1.726647
Mould Compound	Polymer	Phenolic resin		0.316800	2.000000	0.863323
Mould Compound	Pigment	Carbon black	1333-86-4	0.079200	0.500000	0.215831
		Mould Compound Total		15.840000	100.000000	43.166173

Post-Plating	Tin alloy	Tin (Sn)	7440-31-5	1.094484	99.952900	2.982619
Post-Plating	Impurity	Bismuth (Bi)	7440-69-9	0.000164	0.015000	0.000447
Post-Plating	Impurity	Antimony (Sb)	7440-36-0	0.000105	0.009600	0.000286
Post-Plating	Impurity	Copper (Cu)	7440-50-8	0.000088	0.008000	0.000240
Post-Plating	Impurity	Iron (Fe)	7439-89-6	0.000078	0.007000	0.000212
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000027	0.002500	0.000073
Post-Plating	Impurity	Arsenic (As)	7440-38-2	0.000027	0.002500	0.000074
Post-Plating	Impurity	Aluminium (Al)	7429-90-5	0.000011	0.001000	0.000030
Post-Plating	Impurity	Zinc (Zn)	7440-66-6	0.000011	0.001000	0.000030
Post-Plating	Impurity	Cadmium (Cd)	7440-43-9	0.000005	0.000500	0.000014
		Post-Plating Total		1.095000	100.000000	2.984025

Wire	Pure metal	Copper (Cu)	7440-50-8	0.076597	97.700000	0.208737
Wire	Impurity	Non-declarable		0.000078	0.100000	0.000213
Wire	Pure metal layer	Gold (Au)	7440-57-5	0.000157	0.200000	0.000428
		Wire Coating 1 Total		0.000157	0.200000	0.000428
Wire	Pure metal layer	Palladium (Pd)	7440-05-3	0.001568	2.000000	0.004273
		Wire Coating 2 Total		0.001568	2.000000	0.004273
		Wire Total		0.078400	100.000000	0.213651

		NEX5204100BY Total		36.695400		100.000000

Notes
Report created on 2025-02-22 19:54:06 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-02-22 19:54:06 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名称 Material	有毒或有害物质和元素 (Toxic or hazardous substances and elements)
部件名称 Material	铅 (Pb)	镉 (Cd)	汞 (Hg)	六价铬 (Cr⁶⁺)	多溴联苯 (PBB)	多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)	◯	◯	◯	◯	◯	◯
半导体芯片 (Die)	◯	◯	◯	◯	◯	◯
半导体芯片金属化层1 (Die Metallization 1)	◯	◯	◯	◯	◯	◯
半导体芯片金属化层2 (Die Metallization 2)	◯	◯	◯	◯	◯	◯
半导体芯片金属化层3 (Die Metallization 3)	◯	◯	◯	◯	◯	◯
引线框架 (Lead Frame)	◯	◯	◯	◯	◯	◯
预镀层 (Pre-Plating)	◯	◯	◯	◯	◯	◯
模封料 (Mould Compound)	◯	◯	◯	◯	◯	◯
后镀层 (Post-Plating)	◯	◯	◯	◯	◯	◯
导线 (Wire)	◯	◯	◯	◯	◯	◯
导线涂层1 (Wire Coating 1)	◯	◯	◯	◯	◯	◯
导线涂层2 (Wire Coating 2)	◯	◯	◯	◯	◯	◯

◯	表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
✕	表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	该半导体产品具有无限期的环保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-02-22 19:54:06 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

所有产品

双极性晶体管

二极管

ESD保护、TVS、信号调节

MOSFET

SiC MOSFETs

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车

所有应用

汽车

工业和电力

移动和可穿戴应用

计算和消费电子

Sub-systems: Power conversion topologies

子系统

参考设计

评估板

Interactive application notes

Advanced Support Tools

化学成分 NEX5204100BY

双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

化学成分 NEX5204100BY