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Click here for more information74AXP2G14GM
Low-power dual Schmitt trigger inverter
The 74AXP2G14 is a dual inverter with Schmitt-trigger inputs. It transforms slowly changing input signals into sharply defined, jitter-free output signals.
This device ensures very low static and dynamic power consumption across the entire VCC range from 0.7 V to 2.75 V. It is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 0.7 V to 2.75 V
Low input capacitance; CI = 0.5 pF (typical)
Low output capacitance; CO = 1.0 pF (typical)
Low dynamic power consumption; CPD = 2.4 pF at VCC = 1.2 V (typical)
Low static power consumption; ICC = 1.0 μA (85 °C maximum)
High noise immunity
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 2.75 V
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial Power-down mode operation
Complies with JEDEC standard:
JESD8-12A.01 (1.1 V to 1.3 V)
JESD8-11A.01 (1.4 V to 1.6 V)
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A.01 (2.3 V to 2.7 V)
ESD protection:
HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2000 V
CDM JESD22-C101E exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C
参数类型
型号 | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|
74AXP2G14GM | CMOS | ± 4.5 | 70 | 2 | ultra low | -40~85 | XSON6 |
封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74AXP2G14GM | 74AXP2G14GMH (935304096125) |
Withdrawn / End-of-life | rK |
![]() XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_125 |
Series
文档 (12)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AXP2G14 | Low-power dual Schmitt trigger inverter | Data sheet | 2022-02-22 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
axp2g14 | 74AXP2G14 IBIS model | IBIS model | 2015-09-08 |
Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 | AXP – Extremely low-power logic technology portfolio | Leaflet | 2019-04-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
74AXP2G14GM_Nexperia_Product_Reliability | 74AXP2G14GM Nexperia Product Reliability | Quality document | 2022-05-04 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
支持
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How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.