![](https://assets.nexperia.cn/documents/outline-3d/sot1215_3d.png)
Register once, drag and drop ECAD models into your CAD tool and speed up your design.
Click here for more informationPBSS5130QA
30 V, 1 A PNP low VCEsat (BISS) transistor
PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
NPN complement: PBSS4130QA.
Features and benefits
- Very low collector-emitter saturation voltage VCEsat
- High collector current capability IC and ICM
- High collector current gain hFE at high IC
- High energy efficiency due to less heat generation
- Reduced Printed-Circuit Board (PCB) area requirements
- Solderable side pads
- AEC-Q101 qualified
Applications
- Loadswitch
- Battery-driven devices
- Power management
- Charging circuits
- Power switches (e.g. motors, fans)
参数类型
型号 | Package version | Package name | Size (mm) | channel type (e) | Ptot [max] (mW) | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [min] (MHz) | fT [typ] (MHz) | RCEsat@IC [typ] (mΩ) | RCEsat@IC [max] (mΩ) | VCEsat [max] (mV) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PBSS5130QA | SOT1215 | DFN1010D-3 | 1.1 x 1 x 0.37 | PNP | 1000.0 | -30.0 | -1.0 | -1.5 | 250.0 | 425.0 | 120.0 | 170.0 | 160.0 | 240.0 | -260.0 |
封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
PBSS5130QA | PBSS5130QAX (934067167115) |
Obsolete | 00" 10 10 |
![]() DFN1010D-3 (SOT1215) |
SOT1215 |
REFLOW_BG-BD-1
|
暂无信息 |
PBSS5130QAZ (934067167147) |
Obsolete | 00" 10 10 | SOT1215_147 |
Series
文档 (9)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PBSS5130QA | 30 V, 1 A PNP low VCEsat (BISS) transistor | Data sheet | 2017-05-22 |
SOT1215 | 3D model for products with SOT1215 package | Design support | 2019-10-07 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1010D-3_SOT1215_mk | plastic, thermal enhanced ultra thin small outline package; 3 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body | Marcom graphics | 2017-01-28 |
SOT1215 | plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); 3 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body | Package information | 2022-05-27 |
PBSS5130QA_Nexperia_Product_Quality | PBSS5130QA Nexperia Product Quality | Quality document | 2019-05-20 |
PBSS5130QA_Nexperia_Product_Reliability | PBSS5130QA Nexperia Product Reliability Quality document | Quality document | 2020-03-11 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
PBSS5130QA | PBSS5130QA SPICE model | SPICE model | 2024-04-05 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PBSS5130QA | PBSS5130QA SPICE model | SPICE model | 2024-04-05 |
SOT1215 | 3D model for products with SOT1215 package | Design support | 2019-10-07 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.