双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

BSP50

NPN Darlington transistor

NPN Darlington transistor in an SOT223 Surface-Mounted Device (SMD) plastic package.

PNP complement: BSP60

Features and benefits

  • High current of 1 A

  • Low voltage of 45 V

  • Integrated diode and resistor

Applications

  • Industrial high gain amplification

参数类型

型号 Package version Package name Size (mm) hFE [min] toff (ns) fT [min] (MHz) Polarity IC [max] (mA) VCES [max] (V) Ptot [max] (mW) Complement IC [max] (mA) Ptot [max] (mW) VCES [max] (V) fT [min] (MHz) hFE [max] hFE [min] Automotive qualified
BSP50 SOT223 SC-73 6.5 x 3.5 x 1.65 2000 1300 200 NPN 1000 45 1250 BSP60 1000 1250 45 200 >2000 2000 N

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
BSP50 BSP50,115
(933986330115)
Active BSP50 SOT223
SC-73
(SOT223)
SOT223 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
BSP50 BSP50,115 BSP50 rohs rhf rhf
品质及可靠性免责声明

文档 (13)

文件名称 标题 类型 日期
BSP50 NPN Darlington transistor Data sheet 2018-06-06
SOT223 3D model for products with SOT223 package Design support 2019-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SC-73_SOT223_mk plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Marcom graphics 2017-01-28
DERATSMD Power Derating Curves for SMDs; General Other type 1999-05-06
LSYMTRA Letter Symbols - Transistors; General Other type 1999-05-06
SOT223 plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Package information 2022-05-30
SOT223_115 SC-73; Reel pack for SMD, 7"; Q3/T4 product orientation Packing information 2024-02-15
BSP50_Nexperia_Product_Quality BSP50 Nexperia Product Quality Quality document 2019-05-20
BSP50_Nexperia_Product_Reliability BSP50 Nexperia Product Reliability Quality document 2024-04-23
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
BSP50 BSP50 SPICE model SPICE model 2024-08-27
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
BSP50 BSP50 SPICE model SPICE model 2024-08-27
SOT223 3D model for products with SOT223 package Design support 2019-01-22

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
BSP50 BSP50,115 933986330115 Active SOT223_115 1,000 订单产品

样品

作为 Nexperia 的客户,您可以通过我们的销售机构订购样品。

如果您没有 Nexperia 的直接账户,我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
BSP50 BSP50,115 933986330115 SOT223 订单产品