双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74AXP1T125

Dual supply buffer/line driver; 3-state

The 74AXP1T125 is a dual supply non-inverting buffer/line driver with 3-state output. It features one input (A), an output (Y), an output enable input (OE) and dual supply pins (VCCI and VCCO). A HIGH level at pin OE causes the output to assume a high-impedance OFF-state. The inputs are referenced to VCCI and the output is referenced to VCCO. All inputs can be connected directly to VCCI or GND. VCCI can be supplied at any voltage between 0.7 V and 2.75 V and VCCO can be supplied at any voltage between 1.2 V and 5.5 V. This feature allows voltage level translation.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device ensures very low static and dynamic power consumption across the entire supply range and is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range:

    • VCCI: 0.7 V to 2.75 V

    • VCCO: 1.2 V to 5.5 V

  • Low input capacitance; CI = 0.6 pF (typical)

  • Low output capacitance; CO = 1.8 pF (typical)

  • Low dynamic power consumption; CPD = 0.4 pF at VCCI = 1.2 V (typical)

  • Low dynamic power consumption; CPD = 7.1 pF at VCCO = 3.3 V (typical)

  • Low static power consumption; ICCI = 0.5 μA (85 °C maximum)

  • Low static power consumption; ICCO = 1.8 μA (85 °C maximum)

  • High noise immunity

  • Complies with JEDEC standard:

    • JESD8-12A.01 (1.1 V to 1.3 V; A, OE inputs)

    • JESD8-11A.01 (1.4 V to 1.6 V)

    • JESD8-7A (1.65 V to 1.95 V)

    • JESD8-5A.01 (2.3 V to 2.7 V)

    • JESD8-C (2.7 V to 3.6 V; Y output)

    • JESD12-6 (4.5 V to 5.5 V; Y output)

  • ESD protection:

    • HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV

    • CDM JESD22-C101E exceeds 1000 V

  • Latch-up performance exceeds 100 mA per JESD78D Class II

  • Inputs accept voltages up to 2.75 V

  • Low noise overshoot and undershoot < 10% of VCCO

  • IOFF circuitry provides partial power-down mode operation

  • Multiple package options

  • Specified from -40 °C to +85 °C

参数类型

型号

封装

下表中的所有产品型号均已停产 。

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74AXP1T125GM 74AXP1T125GMH
(935306985125)		 Withdrawn / End-of-life rN SOT886
XSON6
(SOT886) 		SOT886 REFLOW_BG-BD-1
SOT886_125
74AXP1T125GN 74AXP1T125GNH
(935306986125)		 Withdrawn / End-of-life rN SOT1115
XSON6
(SOT1115) 		SOT1115 REFLOW_BG-BD-1
暂无信息
74AXP1T125GS 74AXP1T125GSH
(935306987125)		 Discontinued / End-of-life rN SOT1202
XSON6
(SOT1202) 		SOT1202 REFLOW_BG-BD-1
暂无信息
74AXP1T125GX 74AXP1T125GXZ
(935691215147)		 Obsolete no package information

环境信息

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74AXP1T125GM 74AXP1T125GMH 74AXP1T125GM rohs rhf rhf
74AXP1T125GN 74AXP1T125GNH 74AXP1T125GN rohs rhf rhf
74AXP1T125GS 74AXP1T125GSH 74AXP1T125GS rohs rhf rhf
74AXP1T125GX 74AXP1T125GXZ 74AXP1T125GX rohs rhf rhf
品质及可靠性免责声明

文档 (20)

文件名称 标题 类型 日期
74AXP1T125 Dual supply buffer/line driver; 3-state Data sheet 2021-11-03
AN90029 Pin FMEA for AXPnT family Application note 2021-07-13
Nexperia_document_guide_Logic_translators Nexperia Logic Translators Brochure 2021-04-12
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
axp1t125 74AXP1T125 IBIS model IBIS model 2016-03-02
Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 AXP – Extremely low-power logic technology portfolio Leaflet 2019-04-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT1115_mk plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Marcom graphics 2017-01-28
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT1115 plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Package information 2022-05-27
SOT1202 plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body Package information 2022-06-01
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03
MAR_SOT1115 MAR_SOT1115 Topmark Top marking 2013-06-03
MAR_SOT1202 MAR_SOT1202 Topmark Top marking 2013-06-03

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
axp1t125 74AXP1T125 IBIS model IBIS model 2016-03-02

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