参数类型
型号 |
---|
封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74AXP1T125GM | 74AXP1T125GMH (935306985125) |
Discontinued / End-of-life | rN |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_125 |
74AXP1T125GN | 74AXP1T125GNH (935306986125) |
Withdrawn / End-of-life | rN |
XSON6 (SOT1115) |
SOT1115 |
REFLOW_BG-BD-1
|
暂无信息 |
74AXP1T125GS | 74AXP1T125GSH (935306987125) |
Discontinued / End-of-life | rN |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
暂无信息 |
环境信息
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74AXP1T125GM | 74AXP1T125GMH | 74AXP1T125GM | ||
74AXP1T125GN | 74AXP1T125GNH | 74AXP1T125GN | ||
74AXP1T125GS | 74AXP1T125GSH | 74AXP1T125GS |
文档 (20)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AXP1T125 | Dual supply buffer/line driver; 3-state | Data sheet | 2021-11-03 |
AN90029 | Pin FMEA for AXPnT family | Application note | 2021-07-13 |
Nexperia_document_guide_Logic_translators | Nexperia Logic Translators | Brochure | 2021-04-12 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
axp1t125 | 74AXP1T125 IBIS model | IBIS model | 2016-03-02 |
Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 | AXP – Extremely low-power logic technology portfolio | Leaflet | 2019-04-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
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Ordering, pricing & availability
样品
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