参数类型
型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
74HC2G34GV | 2.0 - 6.0 | CMOS | ± 5.2 | 36 | 2 | low | -40~125 | TSOP6 |
74HC2G34GW | 2.0 - 6.0 | CMOS | ± 5.2 | 36 | 2 | low | -40~125 | TSSOP6 |
74HCT2G34GV | 4.5 - 5.5 | TTL | ± 4 | 36 | 2 | low | -40~125 | TSOP6 |
74HCT2G34GW | 4.5 - 5.5 | TTL | ± 4 | 32 | 2 | low | -40~125 | TSSOP6 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74HC2G34GV | 74HC2G34GV,125 (935281037125) |
Active | P34 |
TSOP6 (SOT457) |
SOT457 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT457_125 |
74HC2G34GW | 74HC2G34GW,125 (935281036125) |
Active | PA |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 | |
74HCT2G34GV | 74HCT2G34GV,125 (935281034125) |
Active | U34 |
TSOP6 (SOT457) |
SOT457 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT457_125 |
74HCT2G34GW | 74HCT2G34GW,125 (935281035125) |
Active | UA |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74HC2G34GV | 74HC2G34GV,125 | 74HC2G34GV | ||
74HC2G34GW | 74HC2G34GW,125 | 74HC2G34GW | ||
74HCT2G34GV | 74HCT2G34GV,125 | 74HCT2G34GV | ||
74HCT2G34GW | 74HCT2G34GW,125 | 74HCT2G34GW |
文档 (14)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74HC_HCT2G34 | Dual buffer gate | Data sheet | 2023-12-04 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
mnb063 | Block diagram: 74HC2G34GV, 74HC2G34GW, 74HCT2G34GV, 74HCT2G34GW, 74LVC2G34GF, 74LVC2G34GM, 74LVC2G34GV, 74LVC2G34GW, 74AUP2G34GF, 74AUP2G34GM, 74AUP2G34GW | Block diagram | 2009-11-03 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSOP6_SOT457_mk | plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Marcom graphics | 2017-01-28 |
SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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