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74HC2GU04-Q100
Dual unbuffered inverter
The 74HC2GU04-Q100 is a dual unbuffered inverter. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 V to 6.0 V
CMOS low power dissipation
High noise immunity
Balanced propagation delays
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards
JESD8C (2.7 V to 3.6 V)
JESD7A (2.0 V to 6.0 V)
ESD protection:
MIL-STD-883, method 3015 exceeds 2000 V
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 Ω)
参数类型
型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
74HC2GU04GV-Q100 | 2.0 - 6.0 | CMOS | ± 2.6 | 36 | 2 | low | -40~125 | TSOP6 |
74HC2GU04GW-Q100 | 2.0 - 6.0 | CMOS | ± 2.6 | 36 | 2 | low | -40~125 | TSSOP6 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74HC2GU04GV-Q100 | 74HC2GU04GV-Q100H (935304868125) |
Active | HU4 |
![]() TSOP6 (SOT457) |
SOT457 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT457_125 |
74HC2GU04GW-Q100 | 74HC2GU04GW-Q100H (935304871125) |
Active | PD |
![]() TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74HC2GU04GV-Q100 | 74HC2GU04GV-Q100H | 74HC2GU04GV-Q100 |
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74HC2GU04GW-Q100 | 74HC2GU04GW-Q100H | 74HC2GU04GW-Q100 |
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文档 (12)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74HC2GU04_Q100 | Dual unbuffered inverter | Data sheet | 2022-02-04 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSOP6_SOT457_mk | plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Marcom graphics | 2017-01-28 |
SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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Ordering, pricing & availability
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