参数类型
| 型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|
| 74HC4075D | 2.0 - 6.0 | CMOS | ± 5.2 | 8.0 | 36 | 3 | low | -40~125 | SO14 |
| 74HCT4075D | 4.5 - 5.5 | TTL | ± 4 | 10 | 36 | 3 | low | -40~125 | SO14 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74HC4075D | 74HC4075D,653 (933714190653) |
Active | 74HC4075D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
暂无信息 |
| 74HCT4075D | 74HCT4075D,653 (933714200653) |
Active | 74HCT4075D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
暂无信息 |
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74HC4075D | 74HC4075D,652 (933714190652) |
Withdrawn / End-of-life | 74HC4075D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_652 |
| 74HCT4075DB | 74HCT4075DB,112 (935189390112) |
Obsolete | HT4075 Standard Procedure Standard Procedure |
SSOP14 (SOT337-1) |
SOT337-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暂无信息 |
| 74HCT4075DB,118 (935189390118) |
Obsolete | HT4075 Standard Procedure Standard Procedure | SOT337-1_118 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC4075D | 74HC4075D,653 | 74HC4075D |
|
|
| 74HCT4075D | 74HCT4075D,653 | 74HCT4075D |
|
|
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC4075D | 74HC4075D,652 | 74HC4075D |
|
|
| 74HCT4075DB | 74HCT4075DB,112 | 74HCT4075DB |
|
|
| 74HCT4075DB | 74HCT4075DB,118 | 74HCT4075DB |
|
|
文档 (14)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74HC_HCT4075 | Triple 3-input OR gate | Data sheet | 2024-03-21 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| SSOP14_SOT337-1_mk | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT337-1 | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。
模型
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
Ordering, pricing & availability
样品
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