双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LV138

3-to-8 line decoder/demultiplexer; inverting

The 74LV138 decodes three binary weighted address inputs (A0, A1 and A2) to eight mutually exclusive outputs (Y0 to Y7). The 74LV138 features three enable inputs (Y1, Y2 and E3). Every output will be HIGH unless Y1 and Y2 are LOW and E3 is HIGH. This multiple enable function allows easy parallel expansion of the 74LV138 to a 1-of-32 (5 to 32 lines) decoder with just four 74LV138 ICs and one inverter. The 74LV138 can be used as an eight output demultiplexer by using one of the active LOW enable inputs as the data input and the remaining enable inputs as strobes. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess VCC.

Features and benefits

  • Wide supply voltage range from 1.0 to 5.5 V

  • Optimized for low voltage applications: 1.0 V to 3.6 V

  • CMOS low power dissipation

  • Direct interface with TTL levels

  • Typical output ground bounce < 0.8 V at VCC = 3.3 V and Tamb = 25 °C

  • Typical HIGH-level output voltage (VOH) undershoot: > 2 V at VCC = 3.3 V and Tamb = 25 °C

  • Demultiplexing capability

  • Multiple input enable for easy expansion

  • Ideal for memory chip select decoding

  • Active LOW mutually exclusive outputs

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Complies with JEDEC standards

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) Power dissipation considerations Tamb (°C) Package name
74LV138BQ 1.0 - 5.5 TTL ± 12 12 low -40~125 DHVQFN16
74LV138D 1.0 - 5.5 TTL ± 12 12 low -40~125 SO16
74LV138PW 1.0 - 5.5 TTL ± 12 12 low -40~125 TSSOP16

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LV138BQ 74LV138BQ,115
(935285577115)		 Active LV138 SOT763-1
DHVQFN16
(SOT763-1) 		SOT763-1 SOT763-1_115
74LV138D 74LV138D,118
(935063190118)		 Active 74LV138D SOT109-1
SO16
(SOT109-1) 		SOT109-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT109-1_118
74LV138PW 74LV138PW,118
(935174390118)		 Active LV138 SOT403-1
TSSOP16
(SOT403-1) 		SOT403-1 SSOP-TSSOP-VSO-WAVE
SOT403-1_118

下表中的所有产品型号均已停产 。

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LV138DB 74LV138DB,112
(935165960112)		 Obsolete LV138 SOT338-1
SSOP16
(SOT338-1) 		SOT338-1 SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE
暂无信息
74LV138DB,118
(935165960118)		 Discontinued / End-of-life LV138 暂无信息

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LV138BQ 74LV138BQ,115 74LV138BQ rohs rhf rhf
74LV138D 74LV138D,118 74LV138D rohs rhf rhf
74LV138PW 74LV138PW,118 74LV138PW rohs rhf rhf

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LV138DB 74LV138DB,112 74LV138DB rohs rhf rhf
74LV138DB 74LV138DB,118 74LV138DB rohs rhf rhf
品质及可靠性免责声明

文档 (21)

文件名称 标题 类型 日期
74LV138 3-to-8 line decoder/demultiplexer; inverting Data sheet 2024-01-23
mna370 Block diagram: 74LVC138ABQ, 74LVC138AD, 74LVC138ADB, 74LVC138APW, 74AHC138BQ, 74AHC138D, 74AHC138PW, 74AHCT138BQ, 74AHCT138D, 74AHCT138PW, 74LV138BQ, 74LV138D, 74LV138DB, 74LV138N, 74LV138PW Block diagram 2009-11-04
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN16_SOT763-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body Marcom graphics 2017-01-28
SO16_SOT109-1_mk plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body Marcom graphics 2017-01-28
SSOP16_SOT338-1_mk plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body Marcom graphics 2017-01-28
TSSOP16_SOT403-1_mk plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT763-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body Package information 2023-05-11
SOT109-1 plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT338-1 plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body Package information 2022-06-20
SOT403-1 plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-08
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SSOP-TSSOP-VSO-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
lv lv Spice model SPICE model 2013-05-07
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
lv lv Spice model SPICE model 2013-05-07

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