双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LV165-Q100

8-bit parallel-in/serial-out shift register

The 74LV165-Q100 is an 8-bit serial or parallel-in/serial-out shift register. The device features a serial data input (DS), eight parallel data inputs (D0 to D7) and two complementary serial outputs (Q7 and Q7). When the parallel load input (PL) is LOW the data from D0 to D7 is loaded into the shift register asynchronously. When PL is HIGH data enters the register serially at DS. When the clock enable input (CE) is LOW data is shifted on the LOW-to-HIGH transitions of the CP input. A HIGH on CE will disable the CP input. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess VCC.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 1.0 V to 5.5 V

  • CMOS low power dissipation

  • Direct interface with TTL levels (2.7 V to 3.6 V)

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Optimized for low voltage applications: 1.0 V to 3.6 V

  • Synchronous parallel-to-serial applications

  • Synchronous serial input for easy expansion

  • Complies with JEDEC standards:

    • JESD8-7 (1.65 V to 1.95 V)
    • JESD8-5 (2.3 V to 2.7 V)
    • JESD8C (2.7 V to 3.6 V)
    • JESD36 (4.5 V to 5.5 V)
  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) fmax (MHz) Power dissipation considerations Tamb (°C) Package name
74LV165D-Q100 1.0 - 5.5 TTL ± 12 18 78 low -40~125 SO16
74LV165PW-Q100 1.0 - 5.5 TTL ± 12 18 78 low -40~125 TSSOP16

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LV165D-Q100 74LV165D-Q100J
(935301544118)
Active 74LV165D SOT109-1
SO16
(SOT109-1)
SOT109-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT109-1_118
74LV165PW-Q100 74LV165PW-Q100J
(935301545118)
Active LV165 SOT403-1
TSSOP16
(SOT403-1)
SOT403-1 SSOP-TSSOP-VSO-WAVE
SOT403-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LV165D-Q100 74LV165D-Q100J 74LV165D-Q100 rohs rhf rhf
74LV165PW-Q100 74LV165PW-Q100J 74LV165PW-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (13)

文件名称 标题 类型 日期
74LV165_Q100 8-bit parallel-in/serial-out shift register Data sheet 2024-01-31
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SO16_SOT109-1_mk plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body Marcom graphics 2017-01-28
TSSOP16_SOT403-1_mk plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT109-1 plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT403-1 plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-08
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

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模型

文件名称 标题 类型 日期
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22

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