74LVC374A

参数类型

型号	V_CC (V)	Logic switching levels	Output drive capability (mA)	t_pd (ns)	f_max (MHz)	Power dissipation considerations	T_amb (°C)	Package name
74LVC374ABQ	1.2 - 3.6	CMOS/LVTTL	± 24	2.7	100	low	-40~125	DHVQFN20
74LVC374AD	1.2 - 3.6	CMOS/LVTTL	± 24	2.7	100	low	-40~125	SO20
74LVC374APW	1.2 - 3.6	CMOS/LVTTL	± 24	2.7	100	low	-40~125	TSSOP20

封装

型号	可订购的器件编号，（订购码(12NC)）	状态	标示	封装	外形图	回流焊/波峰焊	包装
74LVC374ABQ	74LVC374ABQ,115 (935273479115)	Active	LVC374A	DHVQFN20 (SOT764-1)	SOT764-1		SOT764-1_115
74LVC374AD	74LVC374AD,118 (935218660118)	Active	74LVC374AD	SO20 (SOT163-1)	SOT163-1	WAVE_BG-BD-1	SOT163-1_118
74LVC374APW	74LVC374APW,118 (935218680118)	Active	LVC374A	TSSOP20 (SOT360-1)	SOT360-1	SSOP-TSSOP-VSO-WAVE	SOT360-1_118

下表中的所有产品型号均已停产。

型号	可订购的器件编号，（订购码(12NC)）	状态	标示	封装	外形图	回流焊/波峰焊	包装
74LVC374ADB	74LVC374ADB/G,118 (935277672118)	Obsolete	LVC374A Standard Procedure Standard Procedure	SSOP20 (SOT339-1)	SOT339-1	SSOP-TSSOP-VSO-WAVE	SOT339-1_118
	74LVC374ADB,112 (935218670112)	Obsolete	LVC374A				暂无信息
	74LVC374ADB,118 (935218670118)	Obsolete	LVC374A				SOT339-1_118
74LVC374APW	74LVC374APW,112 (935218680112)	Withdrawn / End-of-life	LVC374A	TSSOP20 (SOT360-1)	SOT360-1	SSOP-TSSOP-VSO-WAVE	暂无信息

环境信息

型号	可订购的器件编号	化学成分	RoHS	RHF指示符
74LVC374ABQ	74LVC374ABQ,115	74LVC374ABQ
74LVC374AD	74LVC374AD,118	74LVC374AD
74LVC374APW	74LVC374APW,118	74LVC374APW

下表中的所有产品型号均已停产。

型号	可订购的器件编号	化学成分	RoHS	RHF指示符
74LVC374ADB	74LVC374ADB/G,118	74LVC374ADB
74LVC374ADB	74LVC374ADB,112	74LVC374ADB
74LVC374ADB	74LVC374ADB,118	74LVC374ADB
74LVC374APW	74LVC374APW,112	74LVC374APW

品质及可靠性免责声明

文档 (18)

文件名称	标题	类型	日期
74LVC374A	Octal D-type flip-flop; 5 V tolerant inputs/outputs; positive-edge trigger; 3-state	Data sheet	2023-09-01
AN11009	Pin FMEA for LVC family	Application note	2019-01-09
AN263	Power considerations when using CMOS and BiCMOS logic devices	Application note	2023-02-07
SOT764-1	3D model for products with SOT764-1 package	Design support	2019-10-03
SOT163-1	3D model for products with SOT163-1 package	Design support	2020-01-22
SOT360-1	3D model for products with SOT360-1 package	Design support	2020-01-22
lvc374a	lvc374a IBIS model	IBIS model	2013-04-09
Nexperia_package_poster	Nexperia package poster	Leaflet	2020-05-15
DHVQFN20_SOT764-1_mk	plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body	Marcom graphics	2017-01-28
TSSOP20_SOT360-1_mk	plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body	Marcom graphics	2017-01-28
SOT764-1	plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body	Package information	2022-06-21
SOT163-1	plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body	Package information	2022-06-20
SOT339-1	plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body	Package information	2020-04-21
SOT360-1	plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body	Package information	2022-06-21
lvc	lvc Spice model	SPICE model	2013-05-07
Nexperia_Selection_guide_2023	Nexperia Selection Guide 2023	Selection guide	2023-05-10
WAVE_BG-BD-1	Wave soldering profile	Wave soldering	2021-09-08
SSOP-TSSOP-VSO-WAVE	Footprint for wave soldering	Wave soldering	2009-10-08

支持

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模型

文件名称	标题	类型	日期
SOT764-1	3D model for products with SOT764-1 package	Design support	2019-10-03
SOT163-1	3D model for products with SOT163-1 package	Design support	2020-01-22
SOT360-1	3D model for products with SOT360-1 package	Design support	2020-01-22
lvc374a	lvc374a IBIS model	IBIS model	2013-04-09
lvc	lvc Spice model	SPICE model	2013-05-07

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