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74LVT08
3.3 V Quad 2-input AND gate
The 74LVT08 is a quad 2-input AND gate. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 2.7 V to 3.6 V
Overvoltage tolerant inputs to 5.5 V
BiCMOS high speed and output drive
Output capability: +64 mA and -32 mA
Direct interface with TTL levels
No bus current loading when output is tied to 5 V bus
Power-up 3-state
IOFF circuitry provides partial Power-down mode operation
Latch-up performance exceeds 500 mA per JESD 78 Class II Level B
Complies with JEDEC standard: JESD8C (2.7 V to 3.6 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to 85 °C
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74LVT08D | 74LVT08D,118 (935209020118) |
Active | 74LVT08D |
![]() SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
74LVT08PW | 74LVT08PW,118 (935209040118) |
Active | LVT08 |
![]() TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74LVT08DB | 74LVT08DB,112 (935209030112) |
Obsolete | LVT08 |
![]() SSOP14 (SOT337-1) |
SOT337-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暂无信息 |
74LVT08DB,118 (935209030118) |
Obsolete | LVT08 | SOT337-1_118 | ||||
74LVT08PW | 74LVT08PW,112 (935209040112) |
Withdrawn / End-of-life | LVT08 |
![]() TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
暂无信息 |
文档 (19)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVT08 | 3.3 V Quad 2-input AND gate | Data sheet | 2024-04-18 |
sa00343 | Block diagram: 74LVT08D, 74LVT08DB, 74LVT08PW | Block diagram | 2009-11-03 |
SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
lvt08 | lvt08 IBIS model | IBIS model | 2013-04-09 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
SSOP14_SOT337-1_mk | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT337-1 | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
lvt | lvt Spice model | SPICE model | 2013-05-07 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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