双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)
SOT1061D

BC69PAS series

20 V, 2 A PNP medium power transistors

PNP medium power transistors in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.

NPN complement: BC68PAS series

Features and benefits

  • High collector current capability IC and ICM

  • Reduced Printed-Circuit Board (PCB) area requirements

  • Exposed heat sink for excellent thermal and electrical conductivity

  • AEC-Q101 qualified

  • Two current gain selections

  • Leadless very small SMD plastic package with medium power capability

  • Suitable for Automatic Optical Inspection (AOI) of solder joint

Applications

  • Linear voltage regulators

  • Battery driven devices

  • MOSFET drivers

  • High-side switches

  • Power management

  • Amplifiers

参数类型

型号 Package version Package name Size (mm) channel type (e) Ptot (mW) VCEO [max] (V) IC [max] (mA) hFE [min] hFE [max] TJ [max] (°C) fT [min] (MHz)
BC69-16PAS SOT1061D DFN2020D-3 2 x 2 x 0.65 PNP 420.0 -20.0 -2000.0 100.0 250.0 150 40.0
BC69-25PAS SOT1061D DFN2020D-3 2 x 2 x 0.65 PNP 420.0 -20.0 -2000.0 160.0 375.0 150 40.0
BC69PAS SOT1061D DFN2020D-3 2 x 2 x 0.65 PNP 420.0 -20.0 -2000.0 85.0 375.0 150 40.0

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
BC69-16PAS BC69-16PASX
(934068112115)		 Active C2 SOT1061D
DFN2020D-3
(SOT1061D) 		SOT1061D REFLOW_BG-BD-1
SOT1061D_115
BC69-25PAS BC69-25PASX
(934068113115)		 Active C3 SOT1061D
DFN2020D-3
(SOT1061D) 		SOT1061D REFLOW_BG-BD-1
SOT1061D_115
BC69PAS BC69PASX
(934068111115)		 Active C1 SOT1061D
DFN2020D-3
(SOT1061D) 		SOT1061D REFLOW_BG-BD-1
SOT1061D_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
BC69-16PAS BC69-16PASX BC69-16PAS rohs rhf rhf
BC69-25PAS BC69-25PASX BC69-25PAS rohs rhf rhf
BC69PAS BC69PASX BC69PAS rohs rhf rhf
品质及可靠性免责声明

文档 (12)

文件名称 标题 类型 日期
AN90023 Thermal performance of DFN packages Application note 2020-11-23
AN90023_ZH Thermal performance of DFN packages Application note 2021-02-26
Nexperia_asset_document_brochure_autoDFN_CN_LR 小巧轻便的汽车 二极管和晶体管 Brochure 2022-04-26
SOT1061D 3D model for products with SOT1061D package Design support 2021-07-30
Nexperia_AutoDFN_factsheet_2022 Small & light automotive diodes and transistors Leaflet 2022-04-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN2020D-3_SOT1061D_mk plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body Marcom graphics 2017-01-28
SOT1061D plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body Package information 2022-10-10
BC69PAS_Nexperia_Product_Quality BC69PAS Nexperia Product Quality Quality document 2019-05-20
BC69PAS_Nexperia_Product_Reliability BC69PAS Nexperia Product Reliability Quality document 2024-04-23
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
BC69PAS BC69PAS SPICE model SPICE model 2024-04-05

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT1061D 3D model for products with SOT1061D package Design support 2021-07-30
BC69PAS BC69PAS SPICE model SPICE model 2024-04-05

Ordering, pricing & availability

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