双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

SOT223

BCP51-Q Series

45 V, 1 A PNP medium power transistors

PNP medium power transistors in a SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package.

Features and benefits

  • High current

  • Three current gain selections

  • High power dissipation capability

  • Qualified according to AEC-Q101 and recommended for use in automotive applications

Applications

  • Linear voltage regulators

  • High-side switches

  • Battery-driven devices

  • Power management

  • MOSFET drivers

  • Amplifiers

参数类型

型号 Package version Package name Size (mm) channel type (e) Ptot (mW) VCEO [max] (V) IC [max] (mA) hFE [min] hFE [max] Automotive qualified
BCP51-10-Q SOT223 SC-73 6.5 x 3.5 x 1.65 PNP 650 -45 -1000 63 160 Y
BCP51-16-Q SOT223 SC-73 6.5 x 3.5 x 1.65 PNP 650 -45 -1000 100 250 Y
BCP51-Q SOT223 SC-73 6.5 x 3.5 x 1.65 PNP 650 -45 -1000 100 250 Y

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
BCP51-10-Q BCP51-10-QX
(934666364115)
Active BCP51 /10 SOT223
SC-73
(SOT223)
SOT223 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_115
BCP51-10-QF
(934666364135)
Active BCP51 /10 SOT223_135
BCP51-16-Q BCP51-16-QX
(934666365115)
Active BCP51 /16 SOT223
SC-73
(SOT223)
SOT223 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_115
BCP51-16-QF
(934666365135)
Active BCP51 /16 SOT223_135
BCP51-Q BCP51-QX
(934666360115)
Active BCP51 SOT223
SC-73
(SOT223)
SOT223 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
BCP51-10-Q BCP51-10-QX BCP51-10-Q rohs rhf rhf
BCP51-10-Q BCP51-10-QF BCP51-10-Q rohs rhf rhf
BCP51-16-Q BCP51-16-QX BCP51-16-Q rohs rhf rhf
BCP51-16-Q BCP51-16-QF BCP51-16-Q rohs rhf rhf
BCP51-Q BCP51-QX BCP51-Q rohs rhf rhf
品质及可靠性免责声明

文档 (7)

文件名称 标题 类型 日期
BCP51-Q_SER 45 V, 1 A PNP medium power transistors Data sheet 2023-10-16
SOT223 3D model for products with SOT223 package Design support 2019-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SC-73_SOT223_mk plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Marcom graphics 2017-01-28
SOT223 plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Package information 2022-05-30
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

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模型

文件名称 标题 类型 日期
SOT223 3D model for products with SOT223 package Design support 2019-01-22

Ordering, pricing & availability

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