参数类型
型号 | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
---|---|---|---|---|---|---|---|---|---|---|---|---|
BSP41 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 1300.0 | 60.0 | 1000.0 | 100.0 | 300.0 | 150 | 100.0 | Y |
BSP43 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 1300.0 | 80.0 | 1000.0 | 100.0 | 300.0 | 150 | 100.0 | Y |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
BSP41 | BSP41,115 (933982010115) |
Active | BSP41 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
BSP43 | BSP43,115 (933982030115) |
Active | BSP43 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
文档 (8)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
BSP41_43 | NPN medium power transistors | Data sheet | 1999-04-25 |
SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-06 |
SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |