参数类型
型号 | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP3875G | SOT23 | SOT23 | 2.9 x 1.3 x 1 | NPN | 200.0 | 50.0 | 150.0 | 200.0 | 400.0 | 150 | 80.0 | Y |
NXP3875Y | SOT23 | SOT23 | 2.9 x 1.3 x 1 | NPN | 200.0 | 50.0 | 150.0 | 120.0 | 240.0 | 150 | 80.0 | Y |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
NXP3875G | NXP3875GR (934067239215) |
Active | %JF |
(SOT23) |
SOT23 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT23_215 |
NXP3875Y | NXP3875YR (934067238215) |
Active | %JE |
(SOT23) |
SOT23 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT23_215 |
NXP3875YVL (934067238235) |
Active | %JE | SOT23_235 |
文档 (7)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
NXP3875Y_NXP3875G | 50 V, 150 mA NPN general-purpose transistors | Data sheet | 2012-12-12 |
SOT23 | 3D model for products with SOT23 package | Design support | 2019-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SOT23_mk | plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
SOT23 | plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body | Package information | 2022-10-12 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |