参数类型
| 型号 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|
| NXU0304BQ-Q100 | 0.9 - 5.5 | 0.9 - 5.5 | CMOS/LVTTL | ± 12 | 8.1 | 4 | ultra low | -40~125 | DHVQFN14 |
| NXU0304GU12-Q100 | 0.9 - 5.5 | 0.9 - 5.5 | CMOS/LVTTL | ± 12 | 8.1 | 4 | ultra low | -40~125 | XQFN12 |
| NXU0304PW-Q100 | 0.9 - 5.5 | 0.9 - 5.5 | CMOS/LVTTL | ± 12 | 8.1 | 4 | ultra low | -40~125 | TSSOP14 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| NXU0304BQ-Q100 | NXU0304BQ-Q100X (935691851115) |
Active | U0304 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| NXU0304GU12-Q100 | NXU0304GU12-Q100X (935691853115) |
Active | L6 |
XQFN12 (SOT1174-1) |
SOT1174-1 | SOT1174-1_115 | |
| NXU0304PW-Q100 | NXU0304PW-Q100J (935691847118) |
Active | NXU0304 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| NXU0304BQ-Q100 | NXU0304BQ-Q100X | NXU0304BQ-Q100 |
|
|
| NXU0304GU12-Q100 | NXU0304GU12-Q100X | NXU0304GU12-Q100 |
|
|
| NXU0304PW-Q100 | NXU0304PW-Q100J | NXU0304PW-Q100 |
|
|
文档 (14)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| NXU0304_Q100 | 4-bit dual-supply voltage level translating buffer; 3-state | Data sheet | 2024-08-19 |
| AN90057 | Pin FMEA for NXU family | Application note | 2024-09-11 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT1174-1 | 3D model for products with SOT1174-1 package | Design support | 2021-01-28 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| nxu0304 | NXU0304 IBIS model | IBIS model | 2024-09-03 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT1174-1 | plastic, leadless extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 2 mm x 1.7 mm x 0.5 mm body | Package information | 2024-04-11 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| UM90041 | NXU0104, NXU0204 and NXU0304 evaluation board | User manual | 2024-09-11 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。
模型
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT1174-1 | 3D model for products with SOT1174-1 package | Design support | 2021-01-28 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| nxu0304 | NXU0304 IBIS model | IBIS model | 2024-09-03 |
Ordering, pricing & availability
样品
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