双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74AUP1G373

Low-power D-type transparent latch; 3-state

The 74AUP1G373 is a single D-type transparent latch; 3-state. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • High noise immunity

  • CMOS low power dissipation

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP1G373GMProduction0.8 - 3.6CMOS1.9/-1.98.5ultra low-40~1252906.5145XSON6
74AUP1G373GNProduction0.8 - 3.6CMOS1.9/-1.98.5ultra low-40~12527511.7171XSON6
74AUP1G373GSProduction0.8 - 3.6CMOS1.9/-1.98.5ultra low-40~12527214.8177XSON6
74AUP1G373GWProduction0.8 - 3.6CMOS1.9/-1.98.5ultra low-40~12526438.6153TSSOP6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1G373GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActiveaW74AUP1G373GM,132
( 9352 806 22132 )
SOT886_115ActiveaW74AUP1G373GM,115
( 9352 806 22115 )
74AUP1G373GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveaW74AUP1G373GN,132
( 9352 917 38132 )
74AUP1G373GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveaW74AUP1G373GS,132
( 9352 928 63132 )
74AUP1G373GW
TSSOP6
(SOT363-2) 		SOT363-2SOT363-2_125ActiveaW74AUP1G373GW,125
( 9352 806 21125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1G373GM74AUP1G373GM,13274AUP1G373GMAlways Pb-free
74AUP1G373GM74AUP1G373GM,11574AUP1G373GMAlways Pb-free
74AUP1G373GN74AUP1G373GN,13274AUP1G373GNAlways Pb-free
74AUP1G373GS74AUP1G373GS,13274AUP1G373GSAlways Pb-free
74AUP1G373GW74AUP1G373GW,12574AUP1G373GWAlways Pb-free
品质及可靠性免责声明

文档 (16)

文件名称标题类型日期
74AUP1G373Low-power D-type transparent latch; 3-stateData sheet2023-07-13
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup1g373aup1g373 IBIS modelIBIS model2014-12-21
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

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模型

文件名称标题类型日期
aup1g373aup1g373 IBIS modelIBIS model2014-12-21

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