参数类型
型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
74HC1G08GV | 2.0 - 6.0 | CMOS | ± 5.2 | 7.0 | 36 | 1 | low | -40~125 | TSOP5 |
74HC1G08GW | 2.0 - 6.0 | CMOS | ± 5.2 | 7.0 | 36 | 1 | low | -40~125 | TSSOP5 |
74HCT1G08GV | 4.5 - 5.5 | TTL | ± 2 | 11 | 36 | 1 | low | -40~125 | TSOP5 |
74HCT1G08GW | 4.5 - 5.5 | TTL | ± 2 | 11 | 36 | 1 | low | -40~125 | TSSOP5 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74HC1G08GV | 74HC1G08GV,125 (935272015125) |
Active | H08 |
TSOP5 (SOT753) |
SOT753 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT753_125 |
74HC1G08GW | 74HC1G08GW,125 (935245670125) |
Active | HE |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
74HCT1G08GV | 74HCT1G08GV,125 (935272021125) |
Active | T08 |
TSOP5 (SOT753) |
SOT753 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT753_125 |
74HCT1G08GW | 74HCT1G08GW,125 (935245660125) |
Active | TE |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74HC1G08GV | 74HC1G08GV,125 | 74HC1G08GV | ||
74HC1G08GW | 74HC1G08GW,125 | 74HC1G08GW | ||
74HCT1G08GV | 74HCT1G08GV,125 | 74HCT1G08GV | ||
74HCT1G08GW | 74HCT1G08GW,125 | 74HCT1G08GW |
文档 (16)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74HC_HCT1G08 | 2-input AND gate | Data sheet | 2024-09-23 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
mna113 | Block diagram: 74AHC1G08GV, 74AHC1G08GW, 74AHCT1G08GV, 74AHCT1G08GW, 74HC1G08GV, 74HC1G08GW, 74HCT1G08GV, 74HCT1G08GW, 74LVC1G08GF, 74LVC1G08GM, 74LVC1G08GV, 74LVC1G08GW | Block diagram | 2009-11-03 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
hc1g08 | 74HC1G08 IBIS model | IBIS model | 2022-12-21 |
hct1g08 | 74HCT1G08 IBIS model | IBIS model | 2019-01-09 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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