参数类型
型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
74HC299D | 2.0 - 6.0 | CMOS | ± 7.8 | 19 | 54 | 8 | low | -40~125 | SO20 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74HC299D | 74HC299D,653 (933713540653) |
Active | 74HC299D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
暂无信息 |
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74HC299D | 74HC299D,652 (933713540652) |
Withdrawn / End-of-life | 74HC299D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
暂无信息 |
74HC299DB | 74HC299DB,112 (935189890112) |
Obsolete | no package information | ||||
74HC299DB,118 (935189890118) |
Obsolete | ||||||
74HC299PW | 74HC299PW,112 (935286924112) |
Obsolete | HC299 Standard Procedure Standard Procedure |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
暂无信息 |
74HC299PW,118 (935286924118) |
Obsolete | HC299 Standard Procedure Standard Procedure | SOT360-1_118 |
文档 (13)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74HC299 | 8-bit universal shift register; 3-state | Data sheet | 2024-08-05 |
AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
001aai461 | Block diagram: 74HC299D, 74HC299DB, 74HC299N, 74HC299PW, 74HCT299D, 74HCT299DB, 74HCT299N, 74HCT299PW | Block diagram | 2009-11-03 |
SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2022-06-20 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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